EP4SE360F35C2N

The EP4SE360F35C2N is a STRATIX® IV E Field Programmable Gate Array (FPGA) IC from Intel, delivering a high logic capacity device in a compact surface-mount FBGA package. It integrates 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, and 744 I/O pins to support complex, high-density digital designs.

Packaged in a 1152-FBGA (35×35) surface-mount format and specified for commercial operation (0 °C to 85 °C), this RoHS-compliant device operates from a supply range of 870 mV to 930 mV, providing a defined platform for board-level integration where large logic, memory, and I/O resources are required.

Key Features

• Core Logic Capacity  353,600 logic elements provide substantial programmable logic resources for large-scale digital implementations.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM supports data buffering, FIFOs, and on-chip storage without immediate need for external memory.
• I/O Density  744 I/O pins enable extensive interfacing to peripherals, memory devices, and board-level connectors.
• Package & Mounting  1152-BBGA / 1152-FBGA (35×35) FCBGA package in a surface-mount form factor for compact PCB integration.
• Power Supply  Supported supply range of 870 mV to 930 mV for core operation, allowing predictable power budgeting at the board level.
• Operating Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation to suit a wide range of commercial embedded systems.
• Environmental Compliance  RoHS-compliant construction for regulatory alignment in commercial electronics.

Typical Applications

• High-density digital integration  Implements large programmable logic designs that require hundreds of thousands of logic elements and substantial embedded RAM.
• I/O-intensive systems  Connects multiple peripherals and interfaces using the device’s 744 available I/O pins for complex interfacing requirements.
• Compact board-level solutions  Uses the 1152-FBGA surface-mount package to enable space-efficient PCB layouts where board real estate is limited.
• Commercial embedded systems  Deploys in devices and products operating within a 0 °C to 85 °C range and requiring RoHS-compliant components.

Unique Advantages

• Large integrated logic and memory  Combines 353,600 logic elements with approximately 23.1 Mbits of embedded RAM to reduce dependence on external programmable logic and memory chips.
• High I/O capacity  744 I/O pins accommodate extensive peripheral and subsystem connectivity directly at the FPGA.
• Compact FBGA packaging  1152-FBGA (35×35) package supports dense board-level integration while maintaining a surface-mount footprint.
• Defined commercial operating range  Commercial-grade temperature rating (0 °C to 85 °C) and clear supply voltage window simplify thermal and power planning for commercial products.
• RoHS compliance  Environmentally compliant construction supports regulatory requirements for commercial electronics.

Why Choose EP4SE360F35C2N?

The EP4SE360F35C2N positions itself as a high-capacity FPGA option within the STRATIX® IV E family, balancing substantial logic resources, embedded memory, and extensive I/O in a compact FBGA package. Its defined supply range and commercial temperature rating make it suitable for designers targeting complex digital and embedded applications that require predictable electrical and thermal behavior.

This device is well suited for development teams and procurement seeking an Intel STRATIX® IV E FPGA with large on-chip resources, high I/O count, and RoHS-compliant packaging for commercial product designs.

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