EP4SE230F29I4N

The EP4SE230F29I4N is a STRATIX® IV E field programmable gate array (FPGA) IC from Intel. It is built on the Stratix IV E device family architecture and provides high logic capacity and on-chip memory for complex, bandwidth‑oriented designs.

With 228000 logic elements, approximately 17.5 Mbits of embedded memory, and up to 488 I/O pins in a 780‑FBGA (29×29) package, this industrial‑grade FPGA targets applications requiring dense logic, substantial on‑chip RAM and flexible I/O in a surface‑mount package.

Key Features

• Logic Capacity — 228000 logic elements for implementing large, multi‑function digital designs.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM to support buffering, lookup tables and data storage close to logic.
• I/O Density — 488 device I/Os to accommodate wide external interfaces and parallel buses.
• Stratix IV E Architecture — Device family features from the Stratix IV E handbook, including architecture elements such as DSP blocks, PLLs and rich I/O capabilities for high‑performance designs.
• Package and Mounting — 780‑BBGA / 780‑FBGA (29×29) FCBGA surface‑mount package for compact board integration.
• Core Voltage — Core supply range of 870 mV to 930 mV consistent with low‑voltage FPGA cores.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for demanding environmental conditions.
• RoHS Compliance — Conforms to RoHS requirements for lead‑free assembly.

Typical Applications

• High‑Performance Signal Processing — Use the large logic array and embedded memory for DSP pipelines, filtering and real‑time data manipulation.
• Networking and Communications — Leverage Stratix IV E family transceiver and I/O capabilities to implement protocol interfaces and high‑bandwidth links.
• Memory Interfaces and Bridging — Combine abundant on‑chip RAM and extensive I/O to build external memory controllers, buffering and interface bridges.
• Complex Control Systems — Integrate multiple control functions, state machines and peripherals within a single FPGA for industrial applications.

Unique Advantages

• High Logic Density: 228000 logic elements enable consolidation of complex functions and multi‑module designs onto one device, reducing system BOM.
• Significant On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• Extensive I/O Count: 488 I/Os provide flexibility for wide data buses, parallel interfaces and mixed‑signal front ends.
• Industrial‑Grade Temperature Range: −40 °C to 100 °C supports deployments in temperature‑challenging environments.
• Compact FCBGA Packaging: 780‑FBGA (29×29) surface‑mount package offers a high I/O, high‑density footprint for space‑constrained boards.
• RoHS Compliant: Meets lead‑free requirements for current manufacturing and assembly practices.

Why Choose EP4SE230F29I4N?

The EP4SE230F29I4N positions itself as a high‑density, industrial‑grade Stratix IV E FPGA that balances large logic capacity, substantial embedded memory and broad I/O in a compact FCBGA package. It is well suited to engineering teams designing bandwidth‑intensive signal processing, communications interfaces and complex control systems that require a single, integrated programmable device.

Designed within the Stratix IV E device family framework and supported by Intel’s device documentation, this part offers a combination of logic resources, memory and I/O that helps reduce board complexity while meeting robust environmental requirements.

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