EP4SE230F29I3N

IC FPGA 488 I/O 780FBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA

Quantity 717 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SE230F29I3N – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA

The EP4SE230F29I3N is an Intel Stratix IV E FPGA offered in a 780-ball FCBGA package. It delivers a high-capacity FPGA fabric with a large logic element count and substantial on‑chip memory, packaged for surface-mount board integration and industrial-temperature operation.

Designed for high-bandwidth embedded systems and communications or signal-processing applications, this device combines extensive logic resources, flexible I/O, and Stratix IV family architecture features such as DSP blocks, PLLs and high-speed transceiver support as described in the Stratix IV device handbook.

Key Features

  • Logic Capacity — 228,000 logic elements to implement large-scale combinational and sequential logic functions.
  • Embedded Memory — Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) for buffering, packet processing, and state storage.
  • I/O Density — 488 user I/O pins to support wide external connectivity and diverse interface requirements.
  • Stratix IV E Architecture — Device-family features include high-speed transceiver support, DSP blocks, clock networks and PLLs as documented in the Stratix IV device handbook.
  • Power Supply — Core voltage supply range of 870 mV to 930 mV for compatibility with target power-rail designs.
  • Package & Mounting — 780-ball FCBGA (29 × 29) surface-mount package (780-BBGA) for high-density board implementations.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

  • High-Speed Communications — Use the device’s Stratix IV E architecture and high I/O count to implement protocol engines, packet processing, and transceiver interfacing.
  • Signal Processing & DSP — Large logic capacity and embedded memory support complex DSP pipelines and buffering for real‑time processing tasks.
  • Data Aggregation & Switching — High logic density and abundant I/O enable aggregation, switching logic, and custom packet-handling functions.
  • Industrial Control Systems — Industrial temperature rating and robust package make it suitable for demanding factory and infrastructure control applications.

Unique Advantages

  • High Logic Integration: 228,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
  • Substantial On-Chip Memory: Approximately 17.5 Mbits of embedded RAM supports large buffers, FIFOs and local storage without external memory dependency.
  • Flexible I/O Resources: 488 I/Os support diverse external interfaces and parallel connectivity required by complex systems.
  • Industrial Temperature Range: −40 °C to 100 °C operation enables deployment in harsh and temperature-variable environments.
  • Compact, High-Density Package: 780-ball FCBGA (29 × 29) balances high pin count with a compact board footprint for space-constrained designs.
  • Family-Level Architectural Benefits: Built on the Stratix IV E platform, benefiting from family features such as DSP blocks, PLLs and clock network capabilities documented in the device handbook.

Why Choose EP4SE230F29I3N?

The EP4SE230F29I3N positions itself as a high-capacity Stratix IV E FPGA option for engineers who need extensive logic resources, significant on‑chip memory, and a large I/O complement in an industrial-grade, surface-mount package. Its combination of logic density, embedded RAM and family-level architecture features supports demanding communications, signal processing and system-integration designs.

This device is suitable for teams designing scalable, high-performance systems that require a reliable platform and documented family capabilities from Intel’s Stratix IV device handbook. The EP4SE230F29I3N offers a balance of integration, thermal range and package density for long-term deployment in industrial and high-bandwidth embedded applications.

Request a quote or submit an inquiry to obtain pricing, availability and technical assistance for EP4SE230F29I3N. Our team can provide delivery options and support to help integrate this Stratix IV E FPGA into your design.

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