EP4SE230F29I3N
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA |
|---|---|
| Quantity | 717 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SE230F29I3N – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA
The EP4SE230F29I3N is an Intel Stratix IV E FPGA offered in a 780-ball FCBGA package. It delivers a high-capacity FPGA fabric with a large logic element count and substantial on‑chip memory, packaged for surface-mount board integration and industrial-temperature operation.
Designed for high-bandwidth embedded systems and communications or signal-processing applications, this device combines extensive logic resources, flexible I/O, and Stratix IV family architecture features such as DSP blocks, PLLs and high-speed transceiver support as described in the Stratix IV device handbook.
Key Features
- Logic Capacity — 228,000 logic elements to implement large-scale combinational and sequential logic functions.
- Embedded Memory — Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) for buffering, packet processing, and state storage.
- I/O Density — 488 user I/O pins to support wide external connectivity and diverse interface requirements.
- Stratix IV E Architecture — Device-family features include high-speed transceiver support, DSP blocks, clock networks and PLLs as documented in the Stratix IV device handbook.
- Power Supply — Core voltage supply range of 870 mV to 930 mV for compatibility with target power-rail designs.
- Package & Mounting — 780-ball FCBGA (29 × 29) surface-mount package (780-BBGA) for high-density board implementations.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.
Typical Applications
- High-Speed Communications — Use the device’s Stratix IV E architecture and high I/O count to implement protocol engines, packet processing, and transceiver interfacing.
- Signal Processing & DSP — Large logic capacity and embedded memory support complex DSP pipelines and buffering for real‑time processing tasks.
- Data Aggregation & Switching — High logic density and abundant I/O enable aggregation, switching logic, and custom packet-handling functions.
- Industrial Control Systems — Industrial temperature rating and robust package make it suitable for demanding factory and infrastructure control applications.
Unique Advantages
- High Logic Integration: 228,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
- Substantial On-Chip Memory: Approximately 17.5 Mbits of embedded RAM supports large buffers, FIFOs and local storage without external memory dependency.
- Flexible I/O Resources: 488 I/Os support diverse external interfaces and parallel connectivity required by complex systems.
- Industrial Temperature Range: −40 °C to 100 °C operation enables deployment in harsh and temperature-variable environments.
- Compact, High-Density Package: 780-ball FCBGA (29 × 29) balances high pin count with a compact board footprint for space-constrained designs.
- Family-Level Architectural Benefits: Built on the Stratix IV E platform, benefiting from family features such as DSP blocks, PLLs and clock network capabilities documented in the device handbook.
Why Choose EP4SE230F29I3N?
The EP4SE230F29I3N positions itself as a high-capacity Stratix IV E FPGA option for engineers who need extensive logic resources, significant on‑chip memory, and a large I/O complement in an industrial-grade, surface-mount package. Its combination of logic density, embedded RAM and family-level architecture features supports demanding communications, signal processing and system-integration designs.
This device is suitable for teams designing scalable, high-performance systems that require a reliable platform and documented family capabilities from Intel’s Stratix IV device handbook. The EP4SE230F29I3N offers a balance of integration, thermal range and package density for long-term deployment in industrial and high-bandwidth embedded applications.
Request a quote or submit an inquiry to obtain pricing, availability and technical assistance for EP4SE230F29I3N. Our team can provide delivery options and support to help integrate this Stratix IV E FPGA into your design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018