EP4SE230F29C4N
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,602 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SE230F29C4N – STRATIX® IV E Field Programmable Gate Array (FPGA)
The EP4SE230F29C4N is a Stratix IV E FPGA in a 780-FBGA (29 × 29 mm) surface-mount package. It delivers a high logic capacity and on-chip memory with comprehensive device-level features documented in the Stratix IV device handbook and datasheet.
Targeted at designs that require large logic resources, abundant I/O, and integrated DSP and transceiver capabilities, this commercial‑grade device combines 228,000 logic elements with approximately 17.54 Mbits of embedded memory and 488 I/Os for complex, high‑density applications.
Key Features
- Logic Capacity — 228,000 logic elements suitable for large-scale integration of custom logic and state machines.
- Embedded Memory — Approximately 17.54 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive functions.
- I/O Density — 488 general-purpose I/Os to support wide parallel interfaces, multiple peripherals, and complex board-level connectivity.
- On‑chip DSP and Memory Architecture — Device documentation includes dedicated DSP block specifications and TriMatrix memory block information for signal processing and memory partitioning.
- High‑speed Serial and Transceiver Support — The device handbook provides transceiver performance specifications and datapath latency guidance for high‑speed link implementation.
- Clocking and PLLs — Clock tree and PLL specifications are provided in the device documentation to support flexible and precise clock management.
- Configuration and Test — Configuration and JTAG specifications are included in the datasheet for device programming and boundary scan/test integration.
- Low‑voltage Core Supply — Core operating supply specified between 870 mV and 930 mV, enabling designs that use a dedicated low‑voltage core rail.
- Package and Mounting — 780‑ball FCBGA (780‑FBGA, 29 × 29 mm) surface‑mount package for compact, board‑level integration.
- Commercial Temperature Grade & Compliance — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- High‑performance signal processing — Leverage the large logic array, DSP block specifications, and TriMatrix memory for FIR filters, FFTs, and real‑time processing pipelines.
- High‑density I/O bridging — Use 488 I/Os to implement wide parallel interfaces, protocol bridging, or multi‑channel I/O aggregation.
- Prototyping and system integration — Large logic capacity and embedded memory make the device suitable for complex system prototypes and integration of multiple IP blocks.
- High‑speed link implementation — Transceiver performance documentation supports the implementation and tuning of high‑speed serial interfaces and datapaths.
Unique Advantages
- Large programmable fabric: 228,000 logic elements provide the headroom to consolidate complex functions and reduce external glue logic.
- Substantial on‑chip memory: Approximately 17.54 Mbits of embedded RAM helps minimize external memory dependence for many buffering and storage needs.
- High I/O count: 488 I/Os enable dense board-level connectivity and flexible interface design without additional multiplexing hardware.
- Comprehensive device documentation: The Stratix IV device handbook and datasheet include DC/switching characteristics, PLL, clock tree, DSP block, transceiver, and configuration specifications to aid design and validation.
- Compact FCBGA package: 780-ball FBGA (29 × 29 mm) balances high pin count with a compact footprint for space-constrained PCBs.
- Regulatory and temperature clarity: Commercial grade operation (0 °C to 85 °C) and RoHS compliance simplify environmental and regulatory planning.
Why Choose EP4SE230F29C4N?
The EP4SE230F29C4N positions itself as a high‑capacity Stratix IV E FPGA that blends large programmable logic, significant embedded memory, and extensive I/O in a compact 780‑FBGA package. Its documented support for DSP blocks, PLLs, transceivers, and TriMatrix memory makes it suitable for design teams implementing compute‑intensive, I/O‑rich systems that require detailed device‑level guidance.
For engineering teams and procurement focused on scalability and robust design documentation, this commercial‑grade device provides a clear specification set—covering electrical characteristics, configuration, clocking, and performance metrics—backed by the Stratix IV device handbook.
Request a quote or submit an inquiry to check availability and pricing for the EP4SE230F29C4N.

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