EP4SE230F29C3N

The EP4SE230F29C3N is a STRATIX IV E Field Programmable Gate Array (FPGA) from Intel. It provides 228,000 logic elements and approximately 17.5 Mbits of embedded memory in a high-density FCBGA package.

With 488 I/Os, support for Stratix IV E device-family features (including embedded memory and DSP capability), and a surface-mount 780-ball FCBGA (29×29) package, this device addresses high-bandwidth communications, signal-processing and memory-interface applications while operating from a 0.870–0.930 V supply at commercial temperature grades (0 °C to 85 °C).

Key Features

• Core Capacity – 228,000 logic elements to support complex, high-density logic implementations.
• Embedded Memory – Approximately 17.5 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic.
• I/O Density – 488 general-purpose I/Os for dense board-level connectivity and parallel interfaces.
• Device-Family Capabilities – Includes Stratix IV E device-family architecture features such as embedded memory and DSP blocks as described in the device handbook.
• Package and Mounting – 780-ball BBGA FCBGA package (supplier package: 780-FBGA, 29×29); surface-mount for compact board implementation.
• Power – Low-voltage core operation with supply range from 0.870 V to 0.930 V.
• Grade and Temperature – Commercial grade, rated for operation from 0 °C to 85 °C.
• Compliance – RoHS compliant.

Typical Applications

• High-bandwidth Communications – Leverages Stratix IV E device-family high-speed transceiver and bandwidth-oriented architecture to implement protocol interfaces and data aggregation.
• Digital Signal Processing – DSP-capable fabric and substantial embedded memory support filtering, FFTs, and other signal-processing pipelines.
• External Memory Controllers – On-chip resources and I/O count enable implementation of external memory interfaces and controllers.
• System Integration and Prototyping – High logic density and abundant I/O are suited for integration tasks, complex glue logic, and system-level prototyping.

Unique Advantages

• High logic density: 228,000 logic elements enable consolidation of large designs onto a single FPGA to reduce board-level complexity.
• Substantial on-chip RAM: Approximately 17.5 Mbits of embedded memory minimizes dependence on external memory for many buffering and storage needs.
• Extensive I/O connectivity: 488 I/Os provide flexibility for parallel interfaces, high-pin-count peripherals, and dense system routing.
• Compact, production-ready package: 780-ball FCBGA (29×29) surface-mount package supports compact board layouts for space-constrained designs.
• Low-voltage core operation: Narrow supply range (0.870–0.930 V) for consistent core power domain design.
• Documented device family: Part of the Stratix IV E family with supporting device handbook documentation for design reference.

Why Choose EP4SE230F29C3N?

The EP4SE230F29C3N combines large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, making it suitable for designs that require integrated on-chip resources and dense board-level connectivity. Its commercial operating range and RoHS compliance support standard production deployments.

This device is appropriate for engineering teams implementing high-bandwidth communications, DSP-heavy processing, or complex system integration tasks who need a documented Stratix IV E family part with quantifiable on-chip resources and defined electrical and thermal operating limits.

Request a quote or submit an availability and pricing inquiry for EP4SE230F29C3N to receive detailed ordering information and lead times.