EP4SE230F29C4G

The EP4SE230F29C4G is an Intel FPGA delivered on the Stratix IV device family architecture. It provides a programmable logic fabric with a large logic capacity, embedded memory resources and extensive I/O to support complex, configurable digital designs.

Designed for commercial-temperature applications, this device combines approximately 228,000 logic elements with roughly 17.5 Mbits of embedded memory, 488 I/O pins, and a 780-ball FBGA package. Its core supply range of 0.87–0.93 V and RoHS compliance make it suitable for designs that require significant on-chip integration within a standard commercial temperature window (0 °C to 85 °C).

Key Features

• Core Logic  Approximately 228,000 logic elements provide substantial capacity for complex logic, custom accelerators, and system integration.
• Configurable Logic Blocks  9,120 logic block units support scalable partitioning of logic resources across designs.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM for data buffering, lookup tables and local storage.
• I/O Density  488 user I/O pins enable broad connectivity for parallel interfaces, control signals and board-level integration.
• Package & Mounting  780-ball FBGA (29×29) package in a surface-mount form factor for compact board integration.
• Power  Core supply voltage range from 870 mV to 930 mV to match system power domains and supply designs.
• Operating Grade & Temperature  Commercial grade with an operating range of 0 °C to 85 °C for standard temperature applications.
• Standards & Compliance  RoHS compliant to meet environmental directives for lead-free assembly.
• Stratix IV Family Characteristics  As documented in the Stratix IV device handbook, the device family includes architecture and I/O features such as embedded memory, DSP blocks, clock networks and high-speed I/O capabilities.

Typical Applications

• High-speed communications  Leverages the Stratix IV family I/O and transceiver-related architecture for protocol implementation and interface bridging.
• Signal processing and DSP acceleration  Uses the device’s large logic element count and embedded memory to implement DSP functions and real-time processing pipelines.
• Memory interface and buffering  Combines on-chip RAM and external memory interface capabilities to handle buffering, packet processing or frame storage tasks.
• Custom logic and prototyping  Provides the capacity and I/O density required for board-level prototypes, hardware emulation and custom system functions.

Unique Advantages

• Substantial logic capacity:  Approximately 228,000 logic elements allow consolidation of multiple functions into a single device, reducing system complexity.
• Significant embedded memory:  About 17.5 Mbits of on-chip RAM supports data buffering, lookup tables and state storage without immediate reliance on external memory.
• High I/O count:  488 user I/Os enable flexible board-level connectivity and parallel interfacing for complex systems.
• Compact surface-mount package:  780-FBGA (29×29) simplifies placement on high-density PCBs while preserving I/O and thermal performance characteristics typical of BGA packages.
• Commercial temperature suitability:  Rated 0 °C to 85 °C for applications that operate within standard commercial environments.
• Environmentally compliant:  RoHS status ensures compatibility with lead-free manufacturing flows.

Why Choose EP4SE230F29C4G?

The EP4SE230F29C4G offers a combination of substantial logic capacity, embedded memory and a high I/O count within a compact 780-ball FBGA package—properties that make it well suited for complex digital designs that require on-chip integration and flexible interfacing. Its placement within the Stratix IV device family provides access to architecture features documented in the Stratix IV device handbook, including memory, DSP and I/O capabilities.

This device is targeted at designers and teams building commercial-temperature systems that need scalable logic resources, sizable on-chip RAM and broad connectivity while remaining compliant with RoHS requirements. The specified core voltage range and package form factor facilitate integration into standard board-level power and mechanical designs.

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