EP4SE230F29I3

The EP4SE230F29I3 is a STRATIX® IV E field programmable gate array (FPGA) supplied in a 780‑FBGA (29×29) surface-mount package. This device provides a large programmable fabric with 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 488 I/O pins for high-density digital designs.

Designed for industrial-grade deployments, the device supports a supply voltage range of 870 mV to 930 mV and an operating temperature range from −40 °C to 100 °C. The package and electrical specifications make it suitable for boards that require compact surface-mount FCBGA integration and RoHS-compliant components.

Key Features

• Logic Capacity 228,000 logic elements provide a large programmable fabric for complex logic implementation and parallel processing tasks.
• Embedded Memory Approximately 17.5 Mbits of on-chip RAM support frame buffers, lookup tables, and other memory-resident functions without immediate need for external memory.
• I/O Resources 488 available I/O pins support wide data buses and multiple peripheral interfaces on a single device.
• Power Supply Operates from a core supply range of 870 mV to 930 mV, enabling designs that adhere to the specified voltage window.
• Package and Mounting 780‑FBGA (29×29) package in a surface-mount form factor suitable for high-density PCB layouts and FCBGA assemblies.
• Temperature and Grade Industrial-grade device rated for −40 °C to 100 °C operation, appropriate for deployments that require extended temperature range.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• High-density digital processing — Implement large-scale logic networks and parallel processing pipelines using 228,000 logic elements and on-chip memory.
• I/O-rich interface consolidation — Use 488 I/O pins to consolidate multiple interfaces or wide data buses on a single FPGA platform.
• Industrial control and automation — Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in control systems and automation equipment.
• Embedded memory–intensive functions — Approximately 17.5 Mbits of embedded RAM provide on-chip buffering and storage for signal processing and data handling tasks.

Unique Advantages

• Large integrated logic fabric: 228,000 logic elements enable integration of complex designs that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduce dependency on external memory for many applications.
• Extensive I/O count: 488 I/O pins support broad peripheral connectivity and wide parallel interfaces without additional multiplexing hardware.
• Industrial temperature capability: Rated from −40 °C to 100 °C for use in environments with wide temperature variation.
• Compact FCBGA packaging: 780‑FBGA (29×29) surface-mount package supports high-density PCB designs while maintaining RoHS compliance.

Why Choose EP4SE230F29I3?

The EP4SE230F29I3 combines a large logic element count, substantial embedded memory, and a high I/O density in a compact 780‑FBGA surface-mount package, making it suitable for designs that require significant on-chip resources and board-level integration. Its industrial operating range and RoHS compliance align with deployments that demand extended temperature performance and lead-free assembly.

This device is well suited for engineers and system designers working on complex digital processing, interface consolidation, and industrial applications where on-chip memory and I/O count are key determinants of system architecture and long-term deployment reliability.

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