EP4SE230F29C2N

IC FPGA 488 I/O 780FBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA

Quantity 1,512 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SE230F29C2N – STRATIX® IV E Field Programmable Gate Array (FPGA) IC, 780-BBGA FCBGA

The EP4SE230F29C2N is a Stratix IV E FPGA from Intel, implementing the architecture and feature sets described in the Stratix IV Device Handbook. It delivers a large programmable fabric with substantial embedded memory, DSP resources, and comprehensive I/O capability to support high-bandwidth, protocol-flexible designs.

Designed for commercial-grade applications, this device is suited to system designs that require significant on-chip logic, on-chip RAM and extensive I/O while operating within a standard commercial temperature range.

Key Features

  • Core and Logic Stratix IV E architecture with 228,000 logic elements, enabling complex, high-density logic integration on a single device.
  • Embedded Memory Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) to support buffering, lookup tables and state storage for logic-intensive designs.
  • I/O and Transceiver Capability 488 user I/Os and device handbook references for high-speed transceiver features and high-speed differential I/O—supporting a wide range of protocol and interface requirements.
  • DSP Blocks and Clocking Includes dedicated DSP resources and advanced clock networks with PLLs (as documented in the Stratix IV Device Handbook) for deterministic timing and signal processing tasks.
  • External Memory & System Integration Device documentation highlights external memory interface support and system integration features for building high-aggregate-bandwidth solutions and multi-component systems.
  • Package and Mounting Delivered in a 780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface-mount mounting type suitable for compact board-level integration.
  • Power and Temperature Operating supply range from 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS compliant and specified as commercial grade.

Typical Applications

  • High-speed communications — Leverage the device’s high-speed transceiver features and wide protocol support to implement data-paths and link layers with high aggregate bandwidth.
  • Signal processing and DSP — Use the embedded DSP blocks, large logic element count and on-chip RAM to implement filters, transforms and real-time processing pipelines.
  • Custom compute acceleration — Deploy large, application-specific hardware accelerators using the 228,000 logic elements and available memory for on-chip buffering and state retention.
  • Memory interface bridging — Utilize documented external memory interface features for system-level memory control and buffering between peripherals and off-chip memory.

Unique Advantages

  • Highly programmable fabric: 228,000 logic elements provide the density needed for complex custom logic and multi-function designs.
  • Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces reliance on external memory for intermediate buffering and state storage.
  • Extensive I/O count: 488 user I/Os provide flexibility for wide parallel interfaces, control signals and mixed I/O requirements.
  • Package options for compact systems: 780-BBGA (29×29) surface-mount package supports high-density PCB implementations.
  • Documented system features: Stratix IV device handbook coverage of transceivers, DSP blocks, clock networks and external memory interfaces aids architecture and performance planning.
  • Commercial-grade and compliant: Specified operating range of 0 °C to 85 °C and RoHS compliance support standard commercial product deployments.

Why Choose EP4SE230F29C2N?

The EP4SE230F29C2N positions itself as a high-density Stratix IV E FPGA choice for commercial applications that require a combination of large logic capacity, meaningful embedded memory and a broad set of I/O and transceiver capabilities as documented in the device handbook. Its packaging and supply-voltage specification make it appropriate for compact board-level implementations where commercial temperature operation is required.

Engineering teams building high-throughput communications, signal-processing accelerators or complex system controllers will find the combination of logic elements, embedded RAM and documented Stratix IV features useful for reducing external components and consolidating system functionality on a single programmable device.

Request a quote or submit an inquiry to receive pricing, availability and integration support for the EP4SE230F29C2N.

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