EP4SE230F29C2N
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,512 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SE230F29C2N – STRATIX® IV E Field Programmable Gate Array (FPGA) IC, 780-BBGA FCBGA
The EP4SE230F29C2N is a Stratix IV E FPGA from Intel, implementing the architecture and feature sets described in the Stratix IV Device Handbook. It delivers a large programmable fabric with substantial embedded memory, DSP resources, and comprehensive I/O capability to support high-bandwidth, protocol-flexible designs.
Designed for commercial-grade applications, this device is suited to system designs that require significant on-chip logic, on-chip RAM and extensive I/O while operating within a standard commercial temperature range.
Key Features
- Core and Logic Stratix IV E architecture with 228,000 logic elements, enabling complex, high-density logic integration on a single device.
- Embedded Memory Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) to support buffering, lookup tables and state storage for logic-intensive designs.
- I/O and Transceiver Capability 488 user I/Os and device handbook references for high-speed transceiver features and high-speed differential I/O—supporting a wide range of protocol and interface requirements.
- DSP Blocks and Clocking Includes dedicated DSP resources and advanced clock networks with PLLs (as documented in the Stratix IV Device Handbook) for deterministic timing and signal processing tasks.
- External Memory & System Integration Device documentation highlights external memory interface support and system integration features for building high-aggregate-bandwidth solutions and multi-component systems.
- Package and Mounting Delivered in a 780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface-mount mounting type suitable for compact board-level integration.
- Power and Temperature Operating supply range from 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant and specified as commercial grade.
Typical Applications
- High-speed communications — Leverage the device’s high-speed transceiver features and wide protocol support to implement data-paths and link layers with high aggregate bandwidth.
- Signal processing and DSP — Use the embedded DSP blocks, large logic element count and on-chip RAM to implement filters, transforms and real-time processing pipelines.
- Custom compute acceleration — Deploy large, application-specific hardware accelerators using the 228,000 logic elements and available memory for on-chip buffering and state retention.
- Memory interface bridging — Utilize documented external memory interface features for system-level memory control and buffering between peripherals and off-chip memory.
Unique Advantages
- Highly programmable fabric: 228,000 logic elements provide the density needed for complex custom logic and multi-function designs.
- Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces reliance on external memory for intermediate buffering and state storage.
- Extensive I/O count: 488 user I/Os provide flexibility for wide parallel interfaces, control signals and mixed I/O requirements.
- Package options for compact systems: 780-BBGA (29×29) surface-mount package supports high-density PCB implementations.
- Documented system features: Stratix IV device handbook coverage of transceivers, DSP blocks, clock networks and external memory interfaces aids architecture and performance planning.
- Commercial-grade and compliant: Specified operating range of 0 °C to 85 °C and RoHS compliance support standard commercial product deployments.
Why Choose EP4SE230F29C2N?
The EP4SE230F29C2N positions itself as a high-density Stratix IV E FPGA choice for commercial applications that require a combination of large logic capacity, meaningful embedded memory and a broad set of I/O and transceiver capabilities as documented in the device handbook. Its packaging and supply-voltage specification make it appropriate for compact board-level implementations where commercial temperature operation is required.
Engineering teams building high-throughput communications, signal-processing accelerators or complex system controllers will find the combination of logic elements, embedded RAM and documented Stratix IV features useful for reducing external components and consolidating system functionality on a single programmable device.
Request a quote or submit an inquiry to receive pricing, availability and integration support for the EP4SE230F29C2N.

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