EP4S40G5H40I3N

The EP4S40G5H40I3N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA FCBGA package. It integrates a high logic density fabric with substantial on-chip memory and a large I/O count to address complex, programmable digital designs.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, 654 I/O, and an industrial-grade operating range, this device is suited to applications that require dense logic, significant connectivity, and robust operating conditions.

Key Features

• Core Logic  531,200 logic elements provide a high-capacity programmable fabric for implementing large combinational and sequential logic functions.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic blocks.
• I/O Capacity  654 available I/O points to accommodate wide interfaces, parallel buses, and mixed-signal glue logic requirements.
• Power  Nominal voltage supply range of 920 mV to 980 mV to define core power requirements and system power budgeting.
• Package & Mounting  1517-BBGA FCBGA package (supplier package 1517-HBGA, 42.5×42.5 mm) with surface-mount mounting type for compact board integration.
• Operating Range & Grade  Industrial grade with an operating temperature range of 0 °C to 100 °C for deployment in controlled industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Leverages the large logic element count for complex digital signal processing and custom logic architectures.
• I/O-intensive interface hubs  Uses the extensive I/O to consolidate multiple buses, sensors, or peripheral interfaces on a single device.
• Embedded memory-dependent designs  Employs the approximately 28 Mbits of on-chip RAM for buffering, packet processing, or streaming data applications.
• Industrial control and automation  Industrial-grade rating and operating temperature range support deployment in factory automation and machine control systems.

Unique Advantages

• High integration density: The 531,200 logic elements reduce the need for multi-chip solutions, simplifying system architecture and lowering BOM complexity.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM enable larger data sets to be handled on-chip, reducing external memory dependencies.
• Extensive connectivity: 654 I/O provide flexibility to interface with multiple peripherals and high-pin-count buses without additional expansion logic.
• Compact FCBGA packaging: The 1517-BBGA (1517-HBGA, 42.5×42.5 mm) package supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Industrial-ready operation: Industrial grade and 0 °C to 100 °C operating range align the device with controlled industrial application environments.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and regulatory requirements.

Why Choose EP4S40G5H40I3N?

The EP4S40G5H40I3N combines a very large logic element count, significant embedded memory, and extensive I/O in a compact FCBGA package, making it a practical choice for designs that require high integration and dense connectivity. Its industrial grade and defined operating and power ranges allow engineers to plan for reliable operation within controlled industrial environments.

This device is well suited for engineering teams developing complex programmable systems where on-chip resources and I/O capacity can reduce external component count, simplify board-level design, and support scalable implementations.

Request a quote or submit an inquiry to receive pricing and availability details for the EP4S40G5H40I3N. Our team can provide lead-time and ordering information to support your design and procurement process.