EP4SGX110FF35I3G

The EP4SGX110FF35I3G is a Stratix® IV GX field-programmable gate array (FPGA) manufactured by Intel. It integrates a large FPGA fabric with on-chip memory and I/O resources in a 1152‑ball FCBGA/FBGA package for surface-mount assembly.

Designed for applications that require high aggregate bandwidth and flexible protocol support, this industrial‑grade device combines dense logic capacity, abundant embedded memory, and high-speed transceiver features described in the Stratix IV device handbook.

Key Features

• Logic Capacity — 105,600 logic elements for complex digital designs and system integration.
• Embedded Memory — Approximately 9.8 Mbits of on‑chip RAM to support buffering, frame storage, and intermediate data processing.
• I/O Resources — 372 available I/O pins to support broad interfacing and system connectivity.
• High‑Speed Transceiver Features — Includes the Stratix IV GX family’s high-speed transceiver functionality as documented in the device handbook, enabling high aggregate data bandwidth and wide protocol support.
• DSP and Clocking Support — Device handbook references dedicated digital signal processing blocks and PLLs for synchronized, high-performance signal processing and clock management.
• Power and Voltage — Core supply range specified between 870 mV and 930 mV.
• Package and Mounting — 1152‑FBGA (35×35) FCBGA package, surface-mount mounting type appropriate for compact PCB designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployments in industrial environments.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• High‑Bandwidth Networking — Use the device’s high-speed transceiver features and large logic capacity to implement protocol processing and aggregation functions.
• Telecommunications and Data Transport — Leverage wide protocol support and high aggregate data bandwidth for backplane and link-layer processing.
• Signal Processing and DSP — Utilize embedded memory and documented DSP blocks for real‑time processing tasks and algorithm acceleration.
• External Memory Interfaces — Implement external memory controllers and interfaces, supported by the device family’s external memory interface provisions.

Unique Advantages

• Large, Scalable Logic Fabric: 105,600 logic elements support complex state machines, datapaths, and system-on-FPGA architectures.
• Substantial On‑Chip RAM: Approximately 9.8 Mbits of embedded memory reduces dependence on external buffering and simplifies board-level memory architectures.
• Dense I/O Complement: 372 I/O pins provide flexibility for multiple parallel interfaces and mixed-signal front-ends.
• Industrial Reliability: Specified operating range of −40 °C to 100 °C supports reliable operation in industrial environments.
• Compact Surface‑Mount Packaging: 1152‑FBGA (35×35) FCBGA format enables high-density PCB integration while maintaining robust thermal and mechanical characteristics.
• Defined Core Supply Window: A clear core voltage range (870–930 mV) allows precise power‑supply planning for system design.

Why Choose EP4SGX110FF35I3G?

The EP4SGX110FF35I3G positions itself as a high‑capacity Stratix IV GX FPGA suitable for designers who need a combination of large logic resources, significant embedded memory, and extensive I/O in an industrial‑rated package. It is appropriate for development of high‑throughput networking, telecom, and DSP-centric systems where integration and predictable electrical and thermal parameters matter.

Backed by the Stratix IV device family documentation, this Intel-manufactured FPGA offers a clear specification set for power, temperature, and packaging that supports scalable designs and long-term deployments.

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