EP4SGX110FF35I3

The EP4SGX110FF35I3 is a Stratix IV GX field-programmable gate array (FPGA) packaged in a 1152‑ball BGA (FCBGA) designed for designs that require large logic capacity, substantial embedded memory, and extensive I/O. As a member of the Stratix IV GX device family, the part leverages the series’ documented architecture features — including high-speed transceiver capabilities, integrated DSP and memory resources, and advanced clocking — to support high‑bandwidth and high‑integration applications.

Key Features

• Core Logic Provides 105,600 logic elements for implementing large-scale digital logic and custom hardware functions.
• Embedded Memory Approximately 9.79 Mbits of on‑chip RAM to support buffering, packet memory, and complex state machines.
• I/O and Transceiver Capability 372 device I/Os and Stratix IV GX series high‑speed transceiver features as documented in the device handbook for high‑throughput interfaces and protocol support.
• DSP and Signal Processing Includes the Stratix IV family’s documented digital signal processing (DSP) resources for arithmetic and streaming workloads.
• Clocking and PLLs On‑chip clock networks and PLL resources as described in the Stratix IV device handbook to manage complex timing and multiple clock domains.
• Package and Mounting 1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35 mm) optimized for high‑density board designs; surface‑mount package.
• Low‑voltage Core Supply Core voltage range from 870 mV to 930 mV to match system power-rail planning and regulator selection.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for industrial applications.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High‑throughput Communications Implements protocol engines and packet processing leveraging the Stratix IV GX transceiver features and high aggregate bandwidth.
• Network and Infrastructure Equipment Provides large logic capacity and extensive I/O for switching, routing, and interface aggregation functions.
• Signal Processing and DSP Systems Uses on‑chip DSP resources and embedded memory for real‑time filtering, encoding/decoding, and stream processing.
• Advanced Embedded Systems Integrates multiple functions on a single device to reduce BOM and support compact, high‑performance embedded designs.

Unique Advantages

• Large FPGA Fabric: 105,600 logic elements enable consolidation of complex functions and reduce the need for multiple devices.
• Substantial On‑Chip Memory: Approximately 9.79 Mbits of embedded RAM supports buffering and local storage for latency‑sensitive tasks.
• High I/O Density: 372 I/Os facilitate wide parallel interfaces and multiple peripheral connections without external GPIO expanders.
• Industrial‑Grade Operating Range: −40 °C to 100 °C supports deployment in demanding environments where robust thermal tolerance is required.
• Compact, High‑Density Package: 1152‑BBGA (35×35 mm supplier FBGA) delivers high gate density in a surface‑mount form factor for space‑constrained PCBs.
• Power‑Rail Compatibility: Narrow core supply window (870–930 mV) simplifies power‑supply selection for optimized core efficiency.

Why Choose EP4SGX110FF35I3?

The EP4SGX110FF35I3 combines large logic capacity, significant embedded memory, and a high I/O complement in an industrial‑rated Stratix IV GX package. Its documented family features — including high‑speed transceiver support, DSP resources, and advanced clocking — make it well suited for high‑bandwidth, high‑integration system designs that require substantial on‑chip resources and reliable operation across a wide temperature range.

For engineering teams working on communications, networking, or DSP‑intensive embedded platforms, this device offers a scalable, single‑device solution to reduce board complexity and consolidate functions while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX110FF35I3 and to discuss how this FPGA can fit into your next design.