EP4SGX110FF35I3N

The EP4SGX110FF35I3N is a Stratix® IV GX field programmable gate array (FPGA) IC offered in a 1152-BBGA (FCBGA) surface-mount package. It combines a high logic element count with a large on-chip RAM footprint and expansive I/O to address bandwidth‑intensive, protocol‑rich designs.

Designed for industrial-grade applications, the device provides approximately 9.79 Mbits of embedded memory, 105,600 logic elements, and 372 I/O pins, and operates over a supply range of 870 mV to 930 mV with an ambient temperature rating of –40 °C to 100 °C.

Key Features

• Logic Capacity — 105,600 logic elements to implement complex custom logic and large FPGA designs.
• Embedded Memory — Approximately 9.79 Mbits of on-chip RAM for buffer, frame, and intermediate data storage.
• General-Purpose I/O — 372 I/O pins to support wide parallel interfaces, peripherals, and board-level connectivity.
• High-Speed Transceiver and Protocol Support — Stratix IV GX architecture includes high-speed transceiver features and broad protocol support as documented in the device family handbook.
• On-Chip DSP and Timing Resources — Device handbook notes integrated DSP blocks, PLLs, and sophisticated clock networks for signal processing and robust timing control.
• Power — Operates from a 870 mV to 930 mV supply range as specified.
• Package and Mounting — 1152-BBGA (FCBGA) / supplier package 1152-FBGA (35×35); surface-mount for standard PCB assembly.
• Industrial Temperature Rating — Rated for operation from –40 °C to 100 °C for demanding environments.
• Standards and Documentation — Device family handbook details architecture features such as signal integrity, diagnostics, and external memory interfaces useful for system integration.

Typical Applications

• Telecommunications & Networking — Use the device’s high logic density, embedded memory, and high-speed transceiver features for packet processing, backplane interfacing, and protocol conversion tasks.
• Video and Imaging Systems — Large on-chip RAM and extensive logic resources support frame buffering, real-time image processing pipelines, and custom video acceleration.
• DSP and Acceleration — Integrated DSP resources and clock/PLL capabilities enable signal processing, filtering, and compute-acceleration functions.
• Industrial Control and Instrumentation — Industrial temperature rating and abundant I/O make the FPGA suitable for machine control, motor drives, and measurement systems requiring robust operation.

Unique Advantages

• High Logic Density: 105,600 logic elements let you consolidate complex functions into a single device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 9.79 Mbits of on-chip RAM minimizes external memory dependency for buffering and data staging.
• Extensive I/O Count: 372 I/O pins provide flexible interface options for parallel buses, sensors, and external peripherals.
• Designed for High-Bandwidth Designs: Stratix IV GX architecture includes high-speed transceiver features and wide protocol support for demanding data paths.
• Industrial Temperature Range: Rated –40 °C to 100 °C, enabling deployment in harsher ambient conditions.
• Board-Level Compatibility: Surface-mount 1152-BBGA packaging (supplier 1152-FBGA 35×35) supports standard assembly flows and dense board layouts.

Why Choose EP4SGX110FF35I3N?

EP4SGX110FF35I3N positions itself for designs that require high logic density, significant on-chip memory, and broad I/O capability within an industrial temperature envelope. The Stratix IV GX family architecture documented in the device handbook provides feature sets—such as high-speed transceiver support, DSP blocks, PLLs, and comprehensive clock networks—that align with bandwidth‑ and protocol‑intensive systems.

This device is suitable for engineering teams building complex communications, imaging, or signal-processing systems that need a robust, well-documented FPGA platform with on-chip resources to reduce external components and simplify system integration.

Request a quote or submit an inquiry for EP4SGX110FF35I3N to confirm pricing and availability for your next design project.