EP4SGX110HF35C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,365 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110HF35C2 – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX110HF35C2 is a Stratix IV GX family FPGA IC designed for high-density, high-throughput system designs. It combines a large logic fabric with significant on-chip memory and abundant I/O to support complex digital signal processing, high-speed transceiver integration, and external-memory interfacing.
Targeted at applications that require extensive programmable logic, multi-protocol connectivity, and advanced clocking and signal-integrity features, this commercial-grade device delivers integration and design flexibility while operating within a 0 °C to 85 °C range and a core supply window of 870 mV to 930 mV.
Key Features
- Core Logic 105,600 logic elements provide substantial programmable resources for large, complex designs.
- Embedded Memory Approximately 9.79 Mbits of on-chip RAM to support buffering, packet processing, and algorithm state storage.
- I/O Density 488 general-purpose I/O pins offer broad external connectivity for interfaces and peripherals.
- High-Speed Transceiver and I/O Capabilities Device family documentation highlights high-speed differential I/O with features such as DPA and soft-CDR, and broad protocol support for high-bandwidth links.
- Digital Signal Processing Blocks Architecture includes dedicated DSP resources for accelerated arithmetic and signal-processing workloads.
- Clocking and PLLs Extensive clock networks and PLL resources enable flexible timing architectures and multi-clock-domain designs.
- Package & Mounting 1152-BBGA (FCBGA) package, supplier package 1152-FBGA (35×35), in a surface-mount form factor for compact board integration.
- Power and Voltage Core supply specified between 870 mV and 930 mV to align with the device’s power architecture requirements.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-Speed Networking & Communications Use for protocol handling, packet processing, and integration of high-speed transceivers where aggregate bandwidth and multi-protocol support are required.
- Video and Imaging Processing On-chip RAM and DSP resources support real-time video pipelines, frame buffering, and image processing tasks.
- High-Performance Data Processing Large logic capacity and dedicated DSP blocks enable algorithm acceleration and custom compute functions for data-center or appliance-class designs.
- External Memory Interface & System Integration Suitable for designs that require flexible external memory interfaces and complex system-level integration using abundant I/O and advanced clocking.
Unique Advantages
- High logic capacity: 105,600 logic elements to implement complex control, datapath, and custom processing functions without immediate device upsizing.
- Substantial embedded memory: Approximately 9.79 Mbits of on-chip RAM for local buffering and state retention, reducing external memory dependence.
- Rich I/O complement: 488 I/O pins provide design flexibility for interfacing to peripherals, memory, and high-speed links.
- Advanced I/O features: Family-level support for high-speed differential I/O with DPA and soft-CDR and wide protocol compatibility helps integrate diverse link standards.
- Compact, surface-mount FCBGA package: 1152-BBGA (35×35) delivers high pin count in a board-friendly footprint for dense system designs.
- Commercial-grade reliability and compliance: RoHS-compliant construction and a 0 °C to 85 °C operating range suitable for standard commercial environments.
Why Choose EP4SGX110HF35C2?
The EP4SGX110HF35C2 positions itself as a high-capacity Stratix IV GX FPGA option for engineers needing a balance of large programmable logic, meaningful on-chip memory, extensive I/O, and advanced transceiver-capable I/O features. Its combination of DSP resources, clocking primitives, and protocol-ready I/O makes it appropriate for throughput-focused designs and system integration tasks where on-chip resources can reduce external component count.
This device is well suited to teams building networking, video, or compute-accelerator systems that require scalable logic, embedded memory, and flexible interfacing while operating within commercial temperature and voltage constraints.
Request a quote or submit an inquiry to begin your procurement process for EP4SGX110HF35C2 and evaluate how this Stratix IV GX FPGA can fit into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018