EP4SGX110HF35C2

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 1,365 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35C2 – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX110HF35C2 is a Stratix IV GX family FPGA IC designed for high-density, high-throughput system designs. It combines a large logic fabric with significant on-chip memory and abundant I/O to support complex digital signal processing, high-speed transceiver integration, and external-memory interfacing.

Targeted at applications that require extensive programmable logic, multi-protocol connectivity, and advanced clocking and signal-integrity features, this commercial-grade device delivers integration and design flexibility while operating within a 0 °C to 85 °C range and a core supply window of 870 mV to 930 mV.

Key Features

  • Core Logic 105,600 logic elements provide substantial programmable resources for large, complex designs.
  • Embedded Memory Approximately 9.79 Mbits of on-chip RAM to support buffering, packet processing, and algorithm state storage.
  • I/O Density 488 general-purpose I/O pins offer broad external connectivity for interfaces and peripherals.
  • High-Speed Transceiver and I/O Capabilities Device family documentation highlights high-speed differential I/O with features such as DPA and soft-CDR, and broad protocol support for high-bandwidth links.
  • Digital Signal Processing Blocks Architecture includes dedicated DSP resources for accelerated arithmetic and signal-processing workloads.
  • Clocking and PLLs Extensive clock networks and PLL resources enable flexible timing architectures and multi-clock-domain designs.
  • Package & Mounting 1152-BBGA (FCBGA) package, supplier package 1152-FBGA (35×35), in a surface-mount form factor for compact board integration.
  • Power and Voltage Core supply specified between 870 mV and 930 mV to align with the device’s power architecture requirements.
  • Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS compliant.

Typical Applications

  • High-Speed Networking & Communications Use for protocol handling, packet processing, and integration of high-speed transceivers where aggregate bandwidth and multi-protocol support are required.
  • Video and Imaging Processing On-chip RAM and DSP resources support real-time video pipelines, frame buffering, and image processing tasks.
  • High-Performance Data Processing Large logic capacity and dedicated DSP blocks enable algorithm acceleration and custom compute functions for data-center or appliance-class designs.
  • External Memory Interface & System Integration Suitable for designs that require flexible external memory interfaces and complex system-level integration using abundant I/O and advanced clocking.

Unique Advantages

  • High logic capacity: 105,600 logic elements to implement complex control, datapath, and custom processing functions without immediate device upsizing.
  • Substantial embedded memory: Approximately 9.79 Mbits of on-chip RAM for local buffering and state retention, reducing external memory dependence.
  • Rich I/O complement: 488 I/O pins provide design flexibility for interfacing to peripherals, memory, and high-speed links.
  • Advanced I/O features: Family-level support for high-speed differential I/O with DPA and soft-CDR and wide protocol compatibility helps integrate diverse link standards.
  • Compact, surface-mount FCBGA package: 1152-BBGA (35×35) delivers high pin count in a board-friendly footprint for dense system designs.
  • Commercial-grade reliability and compliance: RoHS-compliant construction and a 0 °C to 85 °C operating range suitable for standard commercial environments.

Why Choose EP4SGX110HF35C2?

The EP4SGX110HF35C2 positions itself as a high-capacity Stratix IV GX FPGA option for engineers needing a balance of large programmable logic, meaningful on-chip memory, extensive I/O, and advanced transceiver-capable I/O features. Its combination of DSP resources, clocking primitives, and protocol-ready I/O makes it appropriate for throughput-focused designs and system integration tasks where on-chip resources can reduce external component count.

This device is well suited to teams building networking, video, or compute-accelerator systems that require scalable logic, embedded memory, and flexible interfacing while operating within commercial temperature and voltage constraints.

Request a quote or submit an inquiry to begin your procurement process for EP4SGX110HF35C2 and evaluate how this Stratix IV GX FPGA can fit into your next design.

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