EP4SGX110HF35C3G

The EP4SGX110HF35C3G is an Intel Stratix® IV GX field‑programmable gate array supplied in a 1152‑BBGA (35×35) FCBGA package. It combines a large logic fabric with embedded memory and family features such as high‑speed transceiver support, DSP resources and flexible I/O to address bandwidth‑intensive, compute‑oriented designs.

Designed for commercial‑grade applications, the device targets high‑performance data processing, protocol and interface implementations, and system integration tasks where a high logic count, substantial on‑chip RAM and abundant I/O are required.

Key Features

• Core Logic: 105,600 logic elements provide a large programmable fabric for complex digital designs and custom processing pipelines.
• Embedded Memory: Approximately 9.79 Mbits of on‑chip RAM to implement buffers, FIFOs and local data storage without immediate reliance on external memory.
• I/O Capacity: 488 device I/Os to support broad connectivity and multiple parallel interfaces.
• Family Architecture: Stratix IV GX device features (as documented in the device handbook) including high‑speed transceiver capabilities, DSP block support, clock networks and PLLs for system timing and protocol handling.
• Package & Mounting: 1152‑BBGA (35×35) FCBGA package, supplied in a surface‑mount form factor for modern PCB assembly.
• Power Supply: Core voltage range specified from 870 mV to 930 mV; designers can plan power delivery around this defined supply window.
• Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance: RoHS‑compliant for regulatory and environmental considerations.

Typical Applications

• High‑Bandwidth Data Processing: Large logic capacity and substantial on‑chip RAM make the device suitable for packet processing, data aggregation and high‑throughput datapaths.
• Protocol & Interface Implementation: Abundant I/O and Stratix IV GX transceiver features support implementation of complex interface logic and protocol bridging.
• Signal Processing & DSP: On‑chip memory and family DSP block support enable implementation of real‑time signal processing, filtering and media pipelines.
• System Integration & Prototyping: High logic count and flexible I/O make the FPGA a fit for system integration tasks and platform prototyping that require reprogrammable hardware.

Unique Advantages

• High Logic Density: 105,600 logic elements let you implement extensive custom logic and control functions within a single device, simplifying system design.
• Significant Embedded Memory: Approximately 9.79 Mbits of on‑chip RAM reduces dependence on external memory for intermediate storage and buffering.
• Broad I/O Connectivity: 488 I/Os support multiple parallel buses, sensors, or interfaces without immediate need for additional I/O expanders.
• Stratix IV GX Family Features: Built‑in architectural elements such as high‑speed transceiver support, PLLs and DSP resources provide a proven platform for bandwidth‑focused implementations.
• Surface‑Mount FCBGA Packaging: 1152‑BBGA (35×35) package offers a compact, board‑level solution for high‑pin‑count designs.
• Regulatory Compliance: RoHS compliance supports environmental and supply‑chain requirements.

Why Choose EP4SGX110HF35C3G?

The EP4SGX110HF35C3G delivers a balance of high logic capacity, substantial embedded memory and extensive I/O in a commercial‑grade Stratix IV GX FPGA. Its documented family features—covering high‑speed transceivers, DSP support and robust clocking resources—make it well suited to designers implementing high‑throughput data paths, protocol engines and real‑time processing functions.

For engineering teams needing a high‑integration, reprogrammable device that fits within a defined power and temperature envelope (870–930 mV core supply; 0 °C to 85 °C), this FPGA offers a scalable platform backed by the Stratix IV device handbook and Intel’s device documentation.

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