EP4SGX110HF35C2N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,611 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110HF35C2N – Stratix® IV GX FPGA, 105,600 logic elements, approx. 9.8 Mbits embedded memory, 488 I/Os
The EP4SGX110HF35C2N is a Stratix IV GX Field Programmable Gate Array (FPGA) in a 1152-FBGA (35×35) package designed for surface-mount applications. As a member of the Stratix IV family, the device targets designs that require high logic density, extensive on-chip memory, and broad I/O capability.
Documented family-level features include high-speed transceiver support, wide protocol support and diagnostic features, making this device suitable for applications that need substantial programmable logic, embedded memory and a high pin count within a single FCBGA package.
Key Features
- Core Architecture Stratix IV GX family device architecture with features referenced in the Stratix IV Device Handbook, including architecture-level support for high-speed transceivers and extensive fabric features.
- Logic Density 105,600 logic elements and 4,224 logic blocks provide a large programmable fabric for complex logic and control functions.
- Embedded Memory Approximately 9.8 Mbits of on-chip RAM for packet buffering, frame storage, or intermediate data buffering within algorithms.
- I/O and Interfaces 488 user I/Os and family-level support for high-speed differential I/O with DPA and Soft-CDR enable broad external connectivity and protocol implementation.
- Transceiver and Protocol Support Series-level high-speed transceiver features and wide protocol support are documented for Stratix IV GX devices in the device handbook.
- Clocking and Timing Family documentation includes dedicated clock networks and PLLs to support complex timing and clock-domain requirements.
- Power and Operating Range Core voltage supply range of 870 mV to 930 mV and commercial operating temperature range of 0°C to 85°C.
- Package and Mounting Supplier device package: 1152-FBGA (35×35) / 1152-BBGA, FCBGA; surface mount package for PCB assembly.
- Environmental Compliance RoHS compliant.
Typical Applications
- Telecommunications & Networking Implement packet processing, protocol bridging and high-bandwidth interfaces using the device's high logic count, on-chip memory and family-level transceiver support.
- Data Acquisition & Signal Processing Deploy embedded memory and large programmable fabric for real-time signal processing, buffering and interface aggregation.
- High‑Performance Embedded Systems Use the extensive I/O count and logic resources to implement custom compute blocks, board-level integration and complex control logic.
Unique Advantages
- High logic capacity: 105,600 logic elements allow substantial on-chip implementation of algorithms and control logic, reducing external component counts.
- Large embedded memory: Approximately 9.8 Mbits of on-chip RAM supports buffering and data staging for throughput-intensive designs.
- Broad I/O resources: 488 I/Os provide flexibility for parallel interfaces, wide buses and mixed-signal front-end connections on a single device.
- Series-level high-speed features: Stratix IV GX device family documentation indicates support for high-speed transceivers and protocol flexibility, enabling designs that require substantial data bandwidth.
- Surface-mount FCBGA package: 1152-FBGA (35×35) package offers a high pin-count solution in a compact footprint for dense board designs.
- Commercial temperature and RoHS compliance: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial applications.
Why Choose EP4SGX110HF35C2N?
The EP4SGX110HF35C2N positions itself as a high-density, high-connectivity Stratix IV GX FPGA option for designs that require significant programmable logic, embedded memory and a large number of I/Os in a single FCBGA package. It is suited for engineers building bandwidth‑oriented systems, complex embedded platforms and multi-interface designs within commercial temperature ranges.
Supported by the Stratix IV device documentation, this device provides designers with the architecture-level features and family guidance needed to integrate programmable logic, memory and I/O resources into scalable system designs.
Request a quote or submit a pricing inquiry to obtain availability and ordering information for EP4SGX110HF35C2N.

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