EP4SGX110HF35C2N

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 1,611 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35C2N – Stratix® IV GX FPGA, 105,600 logic elements, approx. 9.8 Mbits embedded memory, 488 I/Os

The EP4SGX110HF35C2N is a Stratix IV GX Field Programmable Gate Array (FPGA) in a 1152-FBGA (35×35) package designed for surface-mount applications. As a member of the Stratix IV family, the device targets designs that require high logic density, extensive on-chip memory, and broad I/O capability.

Documented family-level features include high-speed transceiver support, wide protocol support and diagnostic features, making this device suitable for applications that need substantial programmable logic, embedded memory and a high pin count within a single FCBGA package.

Key Features

  • Core Architecture Stratix IV GX family device architecture with features referenced in the Stratix IV Device Handbook, including architecture-level support for high-speed transceivers and extensive fabric features.
  • Logic Density 105,600 logic elements and 4,224 logic blocks provide a large programmable fabric for complex logic and control functions.
  • Embedded Memory Approximately 9.8 Mbits of on-chip RAM for packet buffering, frame storage, or intermediate data buffering within algorithms.
  • I/O and Interfaces 488 user I/Os and family-level support for high-speed differential I/O with DPA and Soft-CDR enable broad external connectivity and protocol implementation.
  • Transceiver and Protocol Support Series-level high-speed transceiver features and wide protocol support are documented for Stratix IV GX devices in the device handbook.
  • Clocking and Timing Family documentation includes dedicated clock networks and PLLs to support complex timing and clock-domain requirements.
  • Power and Operating Range Core voltage supply range of 870 mV to 930 mV and commercial operating temperature range of 0°C to 85°C.
  • Package and Mounting Supplier device package: 1152-FBGA (35×35) / 1152-BBGA, FCBGA; surface mount package for PCB assembly.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Telecommunications & Networking Implement packet processing, protocol bridging and high-bandwidth interfaces using the device's high logic count, on-chip memory and family-level transceiver support.
  • Data Acquisition & Signal Processing Deploy embedded memory and large programmable fabric for real-time signal processing, buffering and interface aggregation.
  • High‑Performance Embedded Systems Use the extensive I/O count and logic resources to implement custom compute blocks, board-level integration and complex control logic.

Unique Advantages

  • High logic capacity: 105,600 logic elements allow substantial on-chip implementation of algorithms and control logic, reducing external component counts.
  • Large embedded memory: Approximately 9.8 Mbits of on-chip RAM supports buffering and data staging for throughput-intensive designs.
  • Broad I/O resources: 488 I/Os provide flexibility for parallel interfaces, wide buses and mixed-signal front-end connections on a single device.
  • Series-level high-speed features: Stratix IV GX device family documentation indicates support for high-speed transceivers and protocol flexibility, enabling designs that require substantial data bandwidth.
  • Surface-mount FCBGA package: 1152-FBGA (35×35) package offers a high pin-count solution in a compact footprint for dense board designs.
  • Commercial temperature and RoHS compliance: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial applications.

Why Choose EP4SGX110HF35C2N?

The EP4SGX110HF35C2N positions itself as a high-density, high-connectivity Stratix IV GX FPGA option for designs that require significant programmable logic, embedded memory and a large number of I/Os in a single FCBGA package. It is suited for engineers building bandwidth‑oriented systems, complex embedded platforms and multi-interface designs within commercial temperature ranges.

Supported by the Stratix IV device documentation, this device provides designers with the architecture-level features and family guidance needed to integrate programmable logic, memory and I/O resources into scalable system designs.

Request a quote or submit a pricing inquiry to obtain availability and ordering information for EP4SGX110HF35C2N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up