EP4SGX110HF35C4

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 701 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35C4 – Stratix® IV GX FPGA, 105,600 logic elements, 488 I/O, 1152-FBGA

The EP4SGX110HF35C4 is a Stratix® IV GX field-programmable gate array (FPGA) from Intel, delivered in a 1152-ball FCBGA (35 × 35 mm) package for surface-mount applications. The device provides a high logic element count and substantial on-chip RAM to support complex, high-density programmable designs.

Designed for commercial-grade applications, this FPGA combines a large fabric (105,600 logic elements), approximately 9.79 Mbits of embedded memory, and a broad I/O complement (488 pins), enabling designs that require dense logic, substantial memory bandwidth, and extensive external connectivity.

Key Features

  • Core Architecture  Stratix IV GX FPGA family architecture as referenced in the device handbook, supporting advanced fabric capabilities and on-chip resources for complex designs.
  • Logic Capacity  105,600 logic elements to implement high-density logic, control, and state machines within a single device.
  • Embedded Memory  Approximately 9.79 Mbits of on-chip RAM for buffering, look-up tables, and data storage without external memory dependence.
  • I/O and Integration  488 I/O pins delivered in a 1152-FBGA (35 × 35 mm) supplier package, supporting extensive external interfacing and board-level integration.
  • Transceivers and Peripherals  The Stratix IV device family documentation includes transceiver performance and datapath specifications, PLLs, and peripheral block specifications to support high-speed interfaces and clocking architectures.
  • DSP and Memory Blocks  Device handbook references DSP block and TriMatrix memory block specifications for signal processing and block memory functions.
  • Power and Supply  Specified core voltage range between 870 mV and 930 mV for the device core power domain.
  • Package and Mounting  1152-ball BGA (FCBGA) surface-mount package (supplier device package: 1152-FBGA 35×35) for compact PCB assembly.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and specified as Commercial grade.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density logic systems  Implement complex control logic, state machines, and custom processing pipelines using the device’s 105,600 logic elements and embedded memory.
  • Signal processing and DSP  Leverage the device family’s DSP block specifications and TriMatrix memory for algorithm acceleration and real-time data processing.
  • High-performance I/O interfacing  Use the 488 I/O pins and documented transceiver/performance specifications for applications requiring extensive external connectivity and high-bandwidth interfaces.
  • Embedded systems and prototyping  Deploy as a commercial-grade programmable platform for complex embedded designs that need significant logic density and on-chip memory.

Unique Advantages

  • Substantial logic density: 105,600 logic elements enable integration of large, multi-function designs onto a single FPGA to reduce board-level complexity.
  • Significant on-chip memory: Approximately 9.79 Mbits of embedded RAM provides local storage for buffering and state, lowering dependence on external memory.
  • Comprehensive I/O footprint: 488 I/O pins in a 1152-FBGA package support rich external connectivity and high pin-count interfaces.
  • Commercial-grade thermal range: Rated for 0 °C to 85 °C operation to match commercial application needs.
  • Documented device family resources: The Stratix IV device handbook includes detailed sections on electrical characteristics, transceivers, PLLs, DSP blocks, memory blocks, and configuration, aiding design and verification.
  • RoHS compliance: Environmentally compliant for designs requiring RoHS-conforming components.

Why Choose EP4SGX110HF35C4?

The EP4SGX110HF35C4 positions itself as a high-capacity, commercially graded Stratix IV GX FPGA suited to designs that require a combination of large logic resources, substantial embedded memory, and a wide I/O complement. Its documented device-family features—such as transceiver performance, DSP block support, PLLs, and memory block specifications—provide a clear technical foundation for implementing complex, performance-oriented systems.

This device is appropriate for engineering teams building dense programmable logic solutions where integration, on-chip memory, and extensive external connectivity are key. The availability of detailed device handbook material supports design validation and system integration within commercial-temperature applications.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX110HF35C4 and to discuss how this Stratix IV GX FPGA can fit your project requirements.

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