EP4SGX110HF35C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 701 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110HF35C4 – Stratix® IV GX FPGA, 105,600 logic elements, 488 I/O, 1152-FBGA
The EP4SGX110HF35C4 is a Stratix® IV GX field-programmable gate array (FPGA) from Intel, delivered in a 1152-ball FCBGA (35 × 35 mm) package for surface-mount applications. The device provides a high logic element count and substantial on-chip RAM to support complex, high-density programmable designs.
Designed for commercial-grade applications, this FPGA combines a large fabric (105,600 logic elements), approximately 9.79 Mbits of embedded memory, and a broad I/O complement (488 pins), enabling designs that require dense logic, substantial memory bandwidth, and extensive external connectivity.
Key Features
- Core Architecture Stratix IV GX FPGA family architecture as referenced in the device handbook, supporting advanced fabric capabilities and on-chip resources for complex designs.
- Logic Capacity 105,600 logic elements to implement high-density logic, control, and state machines within a single device.
- Embedded Memory Approximately 9.79 Mbits of on-chip RAM for buffering, look-up tables, and data storage without external memory dependence.
- I/O and Integration 488 I/O pins delivered in a 1152-FBGA (35 × 35 mm) supplier package, supporting extensive external interfacing and board-level integration.
- Transceivers and Peripherals The Stratix IV device family documentation includes transceiver performance and datapath specifications, PLLs, and peripheral block specifications to support high-speed interfaces and clocking architectures.
- DSP and Memory Blocks Device handbook references DSP block and TriMatrix memory block specifications for signal processing and block memory functions.
- Power and Supply Specified core voltage range between 870 mV and 930 mV for the device core power domain.
- Package and Mounting 1152-ball BGA (FCBGA) surface-mount package (supplier device package: 1152-FBGA 35×35) for compact PCB assembly.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and specified as Commercial grade.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-density logic systems Implement complex control logic, state machines, and custom processing pipelines using the device’s 105,600 logic elements and embedded memory.
- Signal processing and DSP Leverage the device family’s DSP block specifications and TriMatrix memory for algorithm acceleration and real-time data processing.
- High-performance I/O interfacing Use the 488 I/O pins and documented transceiver/performance specifications for applications requiring extensive external connectivity and high-bandwidth interfaces.
- Embedded systems and prototyping Deploy as a commercial-grade programmable platform for complex embedded designs that need significant logic density and on-chip memory.
Unique Advantages
- Substantial logic density: 105,600 logic elements enable integration of large, multi-function designs onto a single FPGA to reduce board-level complexity.
- Significant on-chip memory: Approximately 9.79 Mbits of embedded RAM provides local storage for buffering and state, lowering dependence on external memory.
- Comprehensive I/O footprint: 488 I/O pins in a 1152-FBGA package support rich external connectivity and high pin-count interfaces.
- Commercial-grade thermal range: Rated for 0 °C to 85 °C operation to match commercial application needs.
- Documented device family resources: The Stratix IV device handbook includes detailed sections on electrical characteristics, transceivers, PLLs, DSP blocks, memory blocks, and configuration, aiding design and verification.
- RoHS compliance: Environmentally compliant for designs requiring RoHS-conforming components.
Why Choose EP4SGX110HF35C4?
The EP4SGX110HF35C4 positions itself as a high-capacity, commercially graded Stratix IV GX FPGA suited to designs that require a combination of large logic resources, substantial embedded memory, and a wide I/O complement. Its documented device-family features—such as transceiver performance, DSP block support, PLLs, and memory block specifications—provide a clear technical foundation for implementing complex, performance-oriented systems.
This device is appropriate for engineering teams building dense programmable logic solutions where integration, on-chip memory, and extensive external connectivity are key. The availability of detailed device handbook material supports design validation and system integration within commercial-temperature applications.
Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX110HF35C4 and to discuss how this Stratix IV GX FPGA can fit your project requirements.

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