EP4SGX110HF35I3G

The EP4SGX110HF35I3G is a Stratix IV GX field-programmable gate array (FPGA) offered in a 1152-ball FBGA (35×35) package for surface-mount assembly. This industrial-grade device integrates 105,600 logic elements and approximately 9.79 Mbits of embedded memory to target high-density, high-performance logic and signal-processing designs.

Designed for applications that demand large I/O counts and robust on-chip resources, the device supports complex protocol handling and high-bandwidth data paths while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Core Logic — 105,600 logic elements provide extensive programmable logic capacity for complex designs and large-scale integration.
• Embedded Memory — Approximately 9.79 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage.
• I/O and System Integration — 488 user I/Os enable extensive external device interfacing and parallel connectivity for high-pin-count designs.
• Stratix IV GX Architecture — Device family features listed in the Stratix IV handbook include high-speed transceiver support, DSP blocks, PLLs, and advanced clock networks for demanding signal-processing and protocol implementations.
• Power — Core voltage supply range specified from 870 mV to 930 mV for compatibility with low-voltage power domains.
• Package & Mounting — 1152-FBGA (35×35) supplier device package; surface-mount mounting type suited for compact, high-density PCB layouts.
• Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS-compliant product.

Typical Applications

• High-bandwidth Networking — Implement packet processing, protocol bridging, and custom switching logic using the device’s large logic and memory resources and extensive I/O count.
• Signal Processing and DSP — Leverage the Stratix IV GX architecture’s DSP-oriented features and embedded memory for real-time filtering, transformation, and throughput-critical processing tasks.
• External Memory Interfaces — Use the embedded RAM and rich I/O complement to implement controllers and interfaces for external memory and high-speed peripherals.
• Test, Measurement and Instrumentation — Deploy in systems that require high logic density, deterministic performance, and wide operating temperature capability.

Unique Advantages

• High integration density: 105,600 logic elements reduce the need for multiple discrete devices and simplify system partitioning.
• Substantial on-chip memory: Approximately 9.79 Mbits of embedded RAM supports in-line buffering and algorithmic state without immediate reliance on external memory.
• Large I/O capacity: 488 I/Os enable broad external connectivity and flexible I/O partitioning for multi-protocol designs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging installations.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package supports high-density PCB assembly and reliable mechanical mounting.
• Low-voltage core operation: 870 mV–930 mV supply range aligns with modern low-power core domains.

Why Choose EP4SGX110HF35I3G?

The EP4SGX110HF35I3G combines significant logic capacity, near-10 Mbits of embedded RAM, and a large 488-pin I/O complement in a single industrial-grade Stratix IV GX device. Its architecture references high-speed transceiver capability, DSP resources, and comprehensive clocking and PLL features from the Stratix IV family, making it suitable for designers implementing complex, high-throughput systems.

This device fits customers needing scalable logic and memory resources with industrial-temperature robustness and a compact 1152-FBGA package—delivering a platform that supports integration, performance, and long-term deployment in demanding applications.

Request a quote or submit an RFQ to receive pricing and availability for EP4SGX110HF35I3G.