EP4SGX110HF35I3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 620 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110HF35I3N – Stratix IV GX FPGA, 1152-FBGA (35×35)
The EP4SGX110HF35I3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) featuring the Stratix IV GX architecture for applications that require high logic density, substantial on-chip memory, and extensive I/O. It is designed for demanding embedded and industrial applications that benefit from high aggregate data bandwidth and flexible I/O integration.
With 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 488 user I/Os in a 1152-FBGA (35×35) surface-mount package, this device targets system designs that need high integration, scalable logic resources, and industrial temperature operation.
Key Features
- Core Architecture Stratix IV GX family FPGA fabric and architecture as referenced in the device handbook, supporting high-performance system integration.
- Logic Capacity 105,600 logic elements provide substantial programmable logic for complex designs and system integration.
- Embedded Memory Approximately 9.79 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
- I/O and Connectivity 488 user I/Os enable dense external interfacing and flexible board-level integration.
- High-Speed Transceiver Features Stratix IV GX device family documentation highlights high-speed transceiver capabilities and broad protocol support suitable for high-bandwidth links.
- DSP Blocks and Clocking Device handbook references integrated digital signal processing resources alongside PLLs and distributed clock networks for synchronous design needs.
- Power and Voltage Core voltage supply range of 0.870 V to 0.930 V, enabling defined low-voltage core operation.
- Package and Mounting 1152-BBGA / 1152-FBGA (35×35) surface-mount package for compact system footprints and high I/O density.
- Temperature Range and Grade Industrial grade operation from −40 °C to 100 °C for deployment in temperature-critical environments.
- Compliance RoHS compliant.
Typical Applications
- Communications & Networking High logic density and documented high-speed transceiver features make the device suitable for network line cards, switching, and protocol bridging where aggregate bandwidth is critical.
- Data Center and Server I/O Large I/O count and dense logic resources support custom I/O aggregation, protocol adaptation, and high-speed interface implementations in server and storage systems.
- High-Performance Signal Processing Embedded memory and referenced DSP resources support algorithm acceleration and streaming data processing tasks.
- Industrial Control and Automation Industrial temperature rating, high I/O density, and robust logic capacity fit control, monitoring, and system-integration roles in industrial equipment.
Unique Advantages
- High Logic Density: 105,600 logic elements enable complex system functions to be implemented on a single device, reducing board-level component count.
- Substantial On-Chip Memory: Approximately 9.79 Mbits of embedded RAM support large buffers and local data storage, reducing external memory bandwidth requirements.
- Dense I/O Integration: 488 user I/Os in a 1152-FBGA package provide flexible external interfacing for systems with many signals or parallel interfaces.
- Industrial Temperature Capability: Operation from −40 °C to 100 °C extends suitability into temperature-challenging environments.
- Low-Voltage Core: Defined 0.870–0.930 V supply range supports low-voltage core operation consistent with high-density FPGA fabrics.
- Documented Transceiver and System Features: Stratix IV GX device handbook references high-speed transceivers, DSP blocks, PLLs, and clock networks to support complex, high-bandwidth designs.
Why Choose EP4SGX110HF35I3N?
The EP4SGX110HF35I3N combines a high logic element count, substantial embedded memory, and a large user I/O complement in a compact 1152-FBGA package, delivering a highly integrated platform for high-bandwidth, industrial-grade designs. Its Stratix IV GX architecture and documented transceiver, DSP, and clocking resources make it suitable for system-level implementations that require both capacity and deterministic behavior across a wide temperature range.
This device is well suited to engineering teams designing communications, data center I/O, high-performance signal processing, and industrial control systems that require scalable logic resources, extensive I/O, and compliance with RoHS. Available technical documentation for the Stratix IV family supports system design and integration tasks.
Request a quote or submit a pricing inquiry to receive availability and ordering information for EP4SGX110HF35I3N.

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