EP4SGX110HF35I3N

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 620 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35I3N – Stratix IV GX FPGA, 1152-FBGA (35×35)

The EP4SGX110HF35I3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) featuring the Stratix IV GX architecture for applications that require high logic density, substantial on-chip memory, and extensive I/O. It is designed for demanding embedded and industrial applications that benefit from high aggregate data bandwidth and flexible I/O integration.

With 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 488 user I/Os in a 1152-FBGA (35×35) surface-mount package, this device targets system designs that need high integration, scalable logic resources, and industrial temperature operation.

Key Features

  • Core Architecture  Stratix IV GX family FPGA fabric and architecture as referenced in the device handbook, supporting high-performance system integration.
  • Logic Capacity  105,600 logic elements provide substantial programmable logic for complex designs and system integration.
  • Embedded Memory  Approximately 9.79 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
  • I/O and Connectivity  488 user I/Os enable dense external interfacing and flexible board-level integration.
  • High-Speed Transceiver Features  Stratix IV GX device family documentation highlights high-speed transceiver capabilities and broad protocol support suitable for high-bandwidth links.
  • DSP Blocks and Clocking  Device handbook references integrated digital signal processing resources alongside PLLs and distributed clock networks for synchronous design needs.
  • Power and Voltage  Core voltage supply range of 0.870 V to 0.930 V, enabling defined low-voltage core operation.
  • Package and Mounting  1152-BBGA / 1152-FBGA (35×35) surface-mount package for compact system footprints and high I/O density.
  • Temperature Range and Grade  Industrial grade operation from −40 °C to 100 °C for deployment in temperature-critical environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Communications & Networking  High logic density and documented high-speed transceiver features make the device suitable for network line cards, switching, and protocol bridging where aggregate bandwidth is critical.
  • Data Center and Server I/O  Large I/O count and dense logic resources support custom I/O aggregation, protocol adaptation, and high-speed interface implementations in server and storage systems.
  • High-Performance Signal Processing  Embedded memory and referenced DSP resources support algorithm acceleration and streaming data processing tasks.
  • Industrial Control and Automation  Industrial temperature rating, high I/O density, and robust logic capacity fit control, monitoring, and system-integration roles in industrial equipment.

Unique Advantages

  • High Logic Density: 105,600 logic elements enable complex system functions to be implemented on a single device, reducing board-level component count.
  • Substantial On-Chip Memory: Approximately 9.79 Mbits of embedded RAM support large buffers and local data storage, reducing external memory bandwidth requirements.
  • Dense I/O Integration: 488 user I/Os in a 1152-FBGA package provide flexible external interfacing for systems with many signals or parallel interfaces.
  • Industrial Temperature Capability: Operation from −40 °C to 100 °C extends suitability into temperature-challenging environments.
  • Low-Voltage Core: Defined 0.870–0.930 V supply range supports low-voltage core operation consistent with high-density FPGA fabrics.
  • Documented Transceiver and System Features: Stratix IV GX device handbook references high-speed transceivers, DSP blocks, PLLs, and clock networks to support complex, high-bandwidth designs.

Why Choose EP4SGX110HF35I3N?

The EP4SGX110HF35I3N combines a high logic element count, substantial embedded memory, and a large user I/O complement in a compact 1152-FBGA package, delivering a highly integrated platform for high-bandwidth, industrial-grade designs. Its Stratix IV GX architecture and documented transceiver, DSP, and clocking resources make it suitable for system-level implementations that require both capacity and deterministic behavior across a wide temperature range.

This device is well suited to engineering teams designing communications, data center I/O, high-performance signal processing, and industrial control systems that require scalable logic resources, extensive I/O, and compliance with RoHS. Available technical documentation for the Stratix IV family supports system design and integration tasks.

Request a quote or submit a pricing inquiry to receive availability and ordering information for EP4SGX110HF35I3N.

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