EP4SGX180DF29C2X

The EP4SGX180DF29C2X is a Stratix IV GX field-programmable gate array (FPGA) in a 780-ball FCBGA package from Intel. It delivers substantial programmable logic and on-chip memory for high‑density, high‑throughput digital designs.

Designed for commercial applications, this device combines a large logic fabric, significant embedded RAM, comprehensive I/O, and family features such as high‑speed transceivers, DSP blocks, PLLs, and advanced clock networks to support demanding communications and signal‑processing workloads.

Key Features

• Logic Capacity — 175,750 logic elements to implement large, complex custom logic and control functions.
• Embedded Memory — Approximately 13.95 Mbits of on‑chip RAM for buffering, protocol staging, and local data storage.
• I/O Density — 372 I/O pins to support broad peripheral and memory interfacing requirements.
• Stratix IV GX Family Features — Device family-level capabilities include high‑speed transceivers, DSP blocks, PLLs, clock networks, and diagnostic/signal‑integrity features as documented in the Stratix IV device handbook.
• Power Supply — Core voltage supply range of 870 mV to 930 mV for power planning and system integration.
• Package & Mounting — 780‑BBGA (780‑FBGA, 29×29) FCBGA package, surface-mountable for compact board designs.
• Operating Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant for regulatory consistency in commercial products.

Typical Applications

• High‑Speed Communications — Use the device’s Stratix IV GX family transceiver and I/O capabilities to implement protocol bridges, line cards, and backplane interfaces.
• Signal Processing & Acceleration — Large logic capacity and embedded RAM support DSP pipelines, dataflow acceleration, and custom processing engines.
• Network & Data Path Control — Implement packet handling, header processing, and traffic management functions leveraging abundant logic and memory resources.
• System Integration / Prototyping — High I/O count and flexible logic make the device suitable for system‑level integration, interface consolidation, and platform prototyping.

Unique Advantages

• High logic density: 175,750 logic elements enable large-scale integration of custom logic, reducing the need for external glue logic.
• Substantial on‑chip memory: Approximately 13.95 Mbits of embedded RAM provide local buffering and state storage to lower external memory bandwidth requirements.
• Extensive I/O: 372 I/O pins support diverse interfaces and parallel connections for complex boards and peripherals.
• Family-level transceiver and DSP support: Stratix IV GX family features (high‑speed transceivers, DSP blocks, PLLs, clock networks) provide architectural building blocks for high‑throughput designs.
• Commercial readiness: Surface-mount FCBGA packaging and a 0 °C–85 °C operating range suit standard commercial deployments.
• Regulatory alignment: RoHS compliance simplifies incorporation into commercial production processes.

Why Choose EP4SGX180DF29C2X?

The EP4SGX180DF29C2X positions itself for designs that require large programmable logic resources, meaningful on‑chip memory, and extensive I/O in a commercial‑grade FPGA. Its alignment with Stratix IV GX family capabilities—such as high‑speed transceivers, DSP structures, and advanced clocking—makes it appropriate for communications, signal processing, and system integration projects where integration density and throughput matter.

Engineers and procurement teams will find value in the device’s combination of logic scale, embedded RAM, and packaging options for compact boards. The device’s documented family features and commercial certification support scalable development and deployment across a range of performance‑oriented designs.

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