EP4SGX110HF35I4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 167 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110HF35I4 – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX110HF35I4 is an Intel Stratix IV GX Field Programmable Gate Array (FPGA) in a 1152‑ball BGA (FCBGA) package designed for industrial applications. It delivers a substantial logic fabric with 105,600 logic elements and approximately 9.79 Mbits of embedded memory, along with on-package features documented in the Stratix IV device handbook.
This device is suited for systems that require high-density programmable logic, plentiful I/O, and on-chip DSP and transceiver capabilities as detailed in the device datasheet. Key electrical and environmental operating parameters include a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C.
Key Features
- Core Capacity — 105,600 logic elements provide a large programmable fabric for complex FPGA designs and system integration.
- Embedded Memory — Approximately 9.79 Mbits of on-chip RAM to support buffering, on-chip storage, and memory-intensive functions; TriMatrix memory block specifications are included in the device documentation.
- I/O and Interfaces — 488 user I/O pins to support broad peripheral and interface connectivity; the datasheet includes transceiver performance specifications for serialized links.
- DSP and Clocking — Device documentation contains DSP block specifications and PLL specifications for high-precision, on-chip signal processing and clock management.
- Power — Core voltage supply specified between 870 mV and 930 mV for defined operating conditions.
- Package & Mounting — 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35); surface-mount mounting type.
- Temperature & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-varied environments.
- Standards Compliance — RoHS compliant.
Typical Applications
- High‑speed communications equipment — On-chip transceiver performance specifications and abundant I/O make the device suitable for platforms requiring serial links and protocol bridging.
- Digital signal processing and acceleration — DSP block specifications and large logic/memory resources support compute-intensive signal-processing pipelines.
- Industrial control and instrumentation — Industrial grade rating and a −40 °C to 100 °C operating range enable use in robust control systems and instrumentation hardware.
Unique Advantages
- High integration density: 105,600 logic elements and approximately 9.79 Mbits of embedded memory reduce the need for external logic and memory components.
- Rich I/O and serial capability: 488 I/O pins combined with documented transceiver specifications enable flexible interfacing and high-speed data paths.
- On-chip DSP and clocking blocks: DSP and PLL specifications in the device documentation simplify implementation of signal processing and precise clocking architectures.
- Industrial operating range: Rated for −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
- Compact, surface-mount package: 1152‑ball FCBGA package offers a high-density footprint for complex designs requiring a small PCB area.
- Regulatory compliance: RoHS compliance supports designs targeting markets with hazardous-material restrictions.
Why Choose EP4SGX110HF35I4?
The EP4SGX110HF35I4 positions itself as a high-density, industrial-grade Stratix IV GX FPGA option that combines large logic capacity, substantial on-chip memory, and extensive I/O in a compact FCBGA package. Its documented DSP, PLL and transceiver capabilities (as referenced in the Stratix IV device handbook and datasheet) make it a fit for designs that require on-chip signal processing, precise clock management, and high-speed serial connectivity.
Manufactured by Intel and supported by the Stratix IV device documentation, this part is aimed at engineering teams building complex embedded systems, communications gear, and industrial control applications that need scalable programmable logic, defined electrical operating limits, and RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability for EP4SGX110HF35I4 and to discuss how this Stratix IV GX FPGA can meet your project requirements.

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