EP4SGX180DF29C2XG

IC FPGA 372 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 317 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180DF29C2XG – * Field Programmable Gate Array (FPGA) IC

The EP4SGX180DF29C2XG is a Stratix IV family FPGA device offered by Intel (Altera). It implements a high-density programmable fabric with dedicated on-chip resources and transceiver-capable I/O to address demanding digital logic and data-path designs.

Targeted at commercial applications, this device provides a balance of logic capacity, embedded memory, and a large I/O complement for high-throughput signal processing, communications, and system integration tasks while operating within a commercial temperature range.

Key Features

  • Core Architecture (Stratix IV): Device architecture and family-level features are documented in the Stratix IV Device Handbook, including fabric, clock networks, PLLs, and architecture-level capabilities.
  • Logic Capacity: Approximately 175,750 logic elements available for implementing complex digital designs and custom accelerators.
  • Embedded Memory: Approximately 13.95 Mbits of on-chip RAM (13,954,048 total RAM bits) to support buffering, FIFOs, and local data storage.
  • DSP and Timing Resources: The device family documentation references digital signal processing blocks, PLLs, and extensive clock-network features for high-performance timing and DSP implementations.
  • I/O and Transceiver Features: 372 user I/O pins and family-level high-speed differential I/O/transceiver features are included for high-bandwidth interfaces and protocol support.
  • Power and Voltage: Core voltage supply range specified at 870 mV to 930 mV.
  • Package and Mounting: 780-FBGA package in a 29 × 29 mm ball-grid format (780-BBGA/FCBGA family); surface-mount device suitable for compact board-level integration.
  • Temperature and Grade: Commercial grade operation from 0 °C to 85 °C.
  • Regulatory: RoHS-compliant.

Typical Applications

  • High‑throughput Communications: Leverages the device family’s high-speed I/O and transceiver features to implement protocol engines and packet-processing pipelines.
  • Digital Signal Processing: Uses embedded memory and documented DSP resources for real‑time filtering, FFTs, and other signal-chain functions.
  • System Integration and Prototyping: Large logic element count and abundant I/O for integrating custom logic, peripheral interfaces, and prototype platform development.
  • External Memory Interfaces: Supports designs that require controlled interfaces to external memory through the device family’s documented memory-interface features.

Unique Advantages

  • High Logic Density: Approximately 175,750 logic elements enable implementation of complex, multi-function designs on a single device.
  • Significant On‑Chip Memory: Approximately 13.95 Mbits of embedded RAM provide local storage for buffering and in-line data processing, reducing dependence on off-chip memory for many functions.
  • Large I/O Count: 372 I/O pins allow broad peripheral connectivity and multiple high-speed interface endpoints from a single package.
  • Transceiver-Capable Fabric: Family-level high-speed I/O and transceiver features documented for the Stratix IV line support high aggregate data bandwidth and protocol flexibility.
  • Compact, Surface-Mount Package: 780-FBGA (29×29) package provides a high-pin-count, board-friendly form factor for dense system designs.
  • Commercial Temperature and RoHS Compliance: Commercial-grade temperature range and RoHS compliance align with standard commercial product requirements.

Why Choose EP4SGX180DF29C2XG?

The EP4SGX180DF29C2XG delivers a combination of high logic capacity, substantial embedded memory, and extensive I/O in a compact 780-FBGA package. Its Stratix IV family architecture—documented in the device handbook—provides the timing, DSP, and transceiver-oriented features designers rely on for high-bandwidth and complex digital systems.

This device is suited for commercial-focused developers and system integrators building communications, signal-processing, and platform integration solutions that require a scalable FPGA fabric with documented architecture support and a high I/O count.

Request a quote or submit a product inquiry to evaluate EP4SGX180DF29C2XG for your design and procurement needs.

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