EP4SGX180DF29C2XG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 317 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180DF29C2XG – * Field Programmable Gate Array (FPGA) IC
The EP4SGX180DF29C2XG is a Stratix IV family FPGA device offered by Intel (Altera). It implements a high-density programmable fabric with dedicated on-chip resources and transceiver-capable I/O to address demanding digital logic and data-path designs.
Targeted at commercial applications, this device provides a balance of logic capacity, embedded memory, and a large I/O complement for high-throughput signal processing, communications, and system integration tasks while operating within a commercial temperature range.
Key Features
- Core Architecture (Stratix IV): Device architecture and family-level features are documented in the Stratix IV Device Handbook, including fabric, clock networks, PLLs, and architecture-level capabilities.
- Logic Capacity: Approximately 175,750 logic elements available for implementing complex digital designs and custom accelerators.
- Embedded Memory: Approximately 13.95 Mbits of on-chip RAM (13,954,048 total RAM bits) to support buffering, FIFOs, and local data storage.
- DSP and Timing Resources: The device family documentation references digital signal processing blocks, PLLs, and extensive clock-network features for high-performance timing and DSP implementations.
- I/O and Transceiver Features: 372 user I/O pins and family-level high-speed differential I/O/transceiver features are included for high-bandwidth interfaces and protocol support.
- Power and Voltage: Core voltage supply range specified at 870 mV to 930 mV.
- Package and Mounting: 780-FBGA package in a 29 × 29 mm ball-grid format (780-BBGA/FCBGA family); surface-mount device suitable for compact board-level integration.
- Temperature and Grade: Commercial grade operation from 0 °C to 85 °C.
- Regulatory: RoHS-compliant.
Typical Applications
- High‑throughput Communications: Leverages the device family’s high-speed I/O and transceiver features to implement protocol engines and packet-processing pipelines.
- Digital Signal Processing: Uses embedded memory and documented DSP resources for real‑time filtering, FFTs, and other signal-chain functions.
- System Integration and Prototyping: Large logic element count and abundant I/O for integrating custom logic, peripheral interfaces, and prototype platform development.
- External Memory Interfaces: Supports designs that require controlled interfaces to external memory through the device family’s documented memory-interface features.
Unique Advantages
- High Logic Density: Approximately 175,750 logic elements enable implementation of complex, multi-function designs on a single device.
- Significant On‑Chip Memory: Approximately 13.95 Mbits of embedded RAM provide local storage for buffering and in-line data processing, reducing dependence on off-chip memory for many functions.
- Large I/O Count: 372 I/O pins allow broad peripheral connectivity and multiple high-speed interface endpoints from a single package.
- Transceiver-Capable Fabric: Family-level high-speed I/O and transceiver features documented for the Stratix IV line support high aggregate data bandwidth and protocol flexibility.
- Compact, Surface-Mount Package: 780-FBGA (29×29) package provides a high-pin-count, board-friendly form factor for dense system designs.
- Commercial Temperature and RoHS Compliance: Commercial-grade temperature range and RoHS compliance align with standard commercial product requirements.
Why Choose EP4SGX180DF29C2XG?
The EP4SGX180DF29C2XG delivers a combination of high logic capacity, substantial embedded memory, and extensive I/O in a compact 780-FBGA package. Its Stratix IV family architecture—documented in the device handbook—provides the timing, DSP, and transceiver-oriented features designers rely on for high-bandwidth and complex digital systems.
This device is suited for commercial-focused developers and system integrators building communications, signal-processing, and platform integration solutions that require a scalable FPGA fabric with documented architecture support and a high I/O count.
Request a quote or submit a product inquiry to evaluate EP4SGX180DF29C2XG for your design and procurement needs.

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