EP4SGX180DF29C2XN

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA

Quantity 630 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180DF29C2XN – Stratix® IV GX Field Programmable Gate Array (FPGA), 780-BBGA (29×29)

The EP4SGX180DF29C2XN is a Stratix IV GX family FPGA from Intel, built for designs that require a high-capacity programmable fabric with Stratix IV GX architecture features such as high-speed transceiver support, embedded DSP blocks and extensive I/O capability. This device targets communications, high-speed data processing, and advanced system integration use cases where large logic capacity and embedded memory are required.

With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 372 I/Os in a 780-FBGA (29×29) surface-mount package, the device delivers a combination of integration density and interface density while operating within a commercial temperature range and low-voltage core supply.

Key Features

  • Core FPGA Fabric 175,750 logic elements provide extensive programmable capacity for complex logic, control, and custom accelerator implementations.
  • Embedded Memory Approximately 13.95 Mbits of on-chip RAM to support buffering, data storage, and local memory for compute pipelines.
  • I/O Density 372 I/O pins enable multiple parallel interfaces and high pin-count system connectivity for external devices and memory.
  • Stratix IV GX Family Features Device documentation describes high-speed transceiver capabilities, DSP blocks, clock networks and PLLs typical of the Stratix IV GX architecture for high-bandwidth and signal-processing applications.
  • Package & Mounting 780-FBGA (29×29) FCBGA package, surface-mount mounting for dense PCB integration and board-level reliability.
  • Power and Operating Range Core voltage supply 870 mV to 930 mV and commercial operating temperature range from 0 °C to 85 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Communications Infrastructure — High I/O count and Stratix IV GX transceiver-oriented architecture make the device suitable for networking line cards, protocol bridging and high-bandwidth packet processing.
  • High-Speed Data Processing — Large logic capacity and embedded memory support real-time data pipelines, packet buffering and protocol acceleration tasks.
  • Signal Processing and DSP — On-chip memory and architecture features described for the Stratix IV GX family support DSP block integration for filtering, FFTs and other signal-processing workloads.
  • Custom Hardware Acceleration — Use as a hardware accelerator for compute-intensive functions where a high number of logic elements and plentiful I/O simplify system integration.

Unique Advantages

  • High logic capacity: 175,750 logic elements enable large-scale integration of control, datapath and accelerator logic within a single device, reducing system complexity.
  • Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM reduces dependence on external memory for many buffering and local-storage needs.
  • Wide external connectivity: 372 I/Os provide flexibility for multi-channel interfaces, parallel buses and external memory connections without multiplexing constraints.
  • Compact, manufacturable package: 780-FBGA (29×29) surface-mount packaging supports dense PCB layouts and standard assembly processes.
  • Low-voltage core operation: 870 mV to 930 mV supply range supports modern low-voltage design domains and power budgeting.
  • Environmental compliance: RoHS compliance aligns with common environmental and supply-chain requirements.

Why Choose EP4SGX180DF29C2XN?

The EP4SGX180DF29C2XN positions itself as a high-capacity Stratix IV GX FPGA option for engineers who need substantial programmable logic, embedded memory and a large I/O complement in a compact BGA package. The device leverages Stratix IV GX family architecture elements—such as high-speed transceiver support and DSP-oriented resources—paired with a commercial operating temperature range and RoHS compliance.

This FPGA is suited for development teams building communication systems, data processing platforms, and hardware-accelerated solutions that require a balance of logic density, on-chip memory and extensive interfacing in a surface-mount 780-FBGA package.

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