EP4SGX180DF29C2XN
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA |
|---|---|
| Quantity | 630 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180DF29C2XN – Stratix® IV GX Field Programmable Gate Array (FPGA), 780-BBGA (29×29)
The EP4SGX180DF29C2XN is a Stratix IV GX family FPGA from Intel, built for designs that require a high-capacity programmable fabric with Stratix IV GX architecture features such as high-speed transceiver support, embedded DSP blocks and extensive I/O capability. This device targets communications, high-speed data processing, and advanced system integration use cases where large logic capacity and embedded memory are required.
With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 372 I/Os in a 780-FBGA (29×29) surface-mount package, the device delivers a combination of integration density and interface density while operating within a commercial temperature range and low-voltage core supply.
Key Features
- Core FPGA Fabric 175,750 logic elements provide extensive programmable capacity for complex logic, control, and custom accelerator implementations.
- Embedded Memory Approximately 13.95 Mbits of on-chip RAM to support buffering, data storage, and local memory for compute pipelines.
- I/O Density 372 I/O pins enable multiple parallel interfaces and high pin-count system connectivity for external devices and memory.
- Stratix IV GX Family Features Device documentation describes high-speed transceiver capabilities, DSP blocks, clock networks and PLLs typical of the Stratix IV GX architecture for high-bandwidth and signal-processing applications.
- Package & Mounting 780-FBGA (29×29) FCBGA package, surface-mount mounting for dense PCB integration and board-level reliability.
- Power and Operating Range Core voltage supply 870 mV to 930 mV and commercial operating temperature range from 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Communications Infrastructure — High I/O count and Stratix IV GX transceiver-oriented architecture make the device suitable for networking line cards, protocol bridging and high-bandwidth packet processing.
- High-Speed Data Processing — Large logic capacity and embedded memory support real-time data pipelines, packet buffering and protocol acceleration tasks.
- Signal Processing and DSP — On-chip memory and architecture features described for the Stratix IV GX family support DSP block integration for filtering, FFTs and other signal-processing workloads.
- Custom Hardware Acceleration — Use as a hardware accelerator for compute-intensive functions where a high number of logic elements and plentiful I/O simplify system integration.
Unique Advantages
- High logic capacity: 175,750 logic elements enable large-scale integration of control, datapath and accelerator logic within a single device, reducing system complexity.
- Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM reduces dependence on external memory for many buffering and local-storage needs.
- Wide external connectivity: 372 I/Os provide flexibility for multi-channel interfaces, parallel buses and external memory connections without multiplexing constraints.
- Compact, manufacturable package: 780-FBGA (29×29) surface-mount packaging supports dense PCB layouts and standard assembly processes.
- Low-voltage core operation: 870 mV to 930 mV supply range supports modern low-voltage design domains and power budgeting.
- Environmental compliance: RoHS compliance aligns with common environmental and supply-chain requirements.
Why Choose EP4SGX180DF29C2XN?
The EP4SGX180DF29C2XN positions itself as a high-capacity Stratix IV GX FPGA option for engineers who need substantial programmable logic, embedded memory and a large I/O complement in a compact BGA package. The device leverages Stratix IV GX family architecture elements—such as high-speed transceiver support and DSP-oriented resources—paired with a commercial operating temperature range and RoHS compliance.
This FPGA is suited for development teams building communication systems, data processing platforms, and hardware-accelerated solutions that require a balance of logic density, on-chip memory and extensive interfacing in a surface-mount 780-FBGA package.
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