EP4SGX180DF29C3N

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA

Quantity 1,200 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180DF29C3N – Stratix® IV GX FPGA, 175,750 logic elements, 780‑FBGA

The EP4SGX180DF29C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) supplied in a 780‑FBGA (29×29) surface‑mount package. It combines a high logic capacity with substantial on‑chip memory and a large I/O count to support complex, programmable digital designs.

Documented in the Stratix IV device handbook, the family includes detailed specifications for core performance, transceivers, PLLs, DSP blocks and TriMatrix memory blocks. This device is designed for commercial‑grade applications that require significant logic density, embedded memory and flexible I/O resources.

Key Features

  • High Logic Capacity — 175,750 logic elements provide extensive programmable logic resources for complex designs and parallel implementations.
  • Embedded Memory — Approximately 13.95 Mbits of on‑chip RAM available to support buffers, FIFOs and local data storage without relying solely on external memory.
  • Extensive I/O — 372 I/O pins support a wide range of interfaces and signal routing options for dense system designs.
  • Transceiver and DSP Capabilities (Device Family) — The Stratix IV device handbook includes transceiver performance specifications and DSP block specifications, enabling high‑speed serial connectivity and on‑chip signal processing when implemented in supported devices.
  • Clocking and PLLs (Device Family) — Clock tree and PLL specifications are provided in the device handbook to support precise timing architectures in system designs.
  • Package and Mounting — 780‑BBGA / 780‑FBGA (29×29) FCBGA package in a surface‑mount form factor for modern PCB assembly.
  • Power and Temperature — Core supply voltage range of 870 mV to 930 mV and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS‑compliant manufacturing status.

Typical Applications

  • High‑performance digital systems — Implement complex, custom logic and control functions that leverage the large logic element count and on‑chip memory.
  • High‑speed serial interfaces — Use the family’s documented transceiver specifications to implement serial communications and protocol bridging in designs that require multi‑lane data paths.
  • Signal processing and acceleration — Deploy on‑chip DSP block resources (documented in the device handbook) together with available embedded memory for deterministic data path processing.
  • Dense I/O and protocol aggregation — Leverage 372 I/O pins for multi‑channel data acquisition, protocol aggregation, and flexible peripheral interfacing.

Unique Advantages

  • Substantial logic and memory in one device: 175,750 logic elements and approximately 13.95 Mbits of embedded RAM reduce dependence on external FPGA fabrics and memory components.
  • Comprehensive design reference documentation: The Stratix IV device handbook provides detailed chapters on electrical characteristics, PLLs, transceivers, DSP blocks and memory blocks to support rigorous engineering design and verification.
  • Large I/O complement: 372 I/Os simplify board‑level integration for complex systems with many external interfaces.
  • Commercial temperature rating: Specified operating range of 0 °C to 85 °C suited to commercial electronics deployments.
  • Standard surface‑mount package: 780‑FBGA (29×29) ball grid package allows integration into modern PCB assembly flows.

Why Choose EP4SGX180DF29C3N?

The EP4SGX180DF29C3N offers a blend of high logic density, significant on‑chip memory and extensive I/O in a commercial‑grade Stratix IV GX device. Its documented family‑level specifications for transceivers, DSP blocks, PLLs and memory blocks provide the technical foundation engineering teams need to implement demanding digital, signal processing and interface‑heavy designs.

This device is well suited for teams and projects requiring a scalable, high‑capacity FPGA platform backed by comprehensive device handbook documentation. It delivers an integrated solution that supports complex designs while helping to consolidate board‑level functions and manage system complexity.

Request a quote or submit an inquiry to start the procurement process for EP4SGX180DF29C3N and receive pricing and availability information tailored to your project requirements.

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