EP4SGX180DF29C4N

The EP4SGX180DF29C4N is a Stratix® IV GX field programmable gate array (FPGA) provided in a 780-ball FCBGA package. It delivers a combination of high logic capacity, on-chip memory, and a large I/O count for complex digital designs.

With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 372 I/Os, this device is targeted at commercial electronic designs that require dense integration of logic and memory in a surface-mount FCBGA footprint.

Key Features

• Core Logic  175,750 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 13.95 Mbits of on-chip RAM for buffering, packet handling, and local data storage.
• I/O Capacity  372 general-purpose I/Os to support multiple external interfaces and board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power architectures and enable consistent operation across the specified range.
• Package & Mounting  780-BBGA (FCBGA) surface-mount package, supplier device package 780-FBGA (29×29), for compact board-level integration.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C and RoHS compliant for environmental standards.

Typical Applications

• FPGA-based prototyping and development  Use the large logic element count and substantial embedded memory to implement and validate complex digital designs on prototypes and evaluation platforms.
• High-density I/O systems  The 372 I/Os support designs that consolidate multiple interfaces or parallel connections onto a single FPGA.
• Compact commercial electronics  The 780-FBGA (29×29) surface-mount package enables integration into space-constrained commercial equipment while maintaining high logic and memory capacity.

Unique Advantages

• High logic density: 175,750 logic elements provide substantial capacity for implementing large-scale logic functions on a single device.
• Significant on-chip RAM: Approximately 13.95 Mbits of embedded memory reduces reliance on external memory for many buffering and caching tasks.
• Extensive I/O count: 372 I/Os let you consolidate multiple interfaces and reduce PCB complexity.
• Compact FCBGA package: 780-BBGA (29×29) footprint supports compact board layouts while offering high pin-count connectivity.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to meet common commercial manufacturing and environmental requirements.
• Surface-mount design: Standard surface-mount mounting simplifies assembly for modern PCB production.

Why Choose EP4SGX180DF29C4N?

The EP4SGX180DF29C4N positions itself as a high-capacity, commercially graded FPGA option for designs that require significant on-chip logic, memory, and I/O in a compact surface-mount package. Its combination of 175,750 logic elements, approximately 13.95 Mbits of embedded RAM, and 372 I/Os supports integration of complex digital functions with fewer external components.

This device is suited for commercial electronic designs where board space, I/O density, and embedded memory are key considerations. RoHS compliance and the specified operating temperature range support reliable deployment in standard commercial environments.

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