EP4SGX180DF29I4

The EP4SGX180DF29I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivering a high density of programmable logic and embedded memory in a 780-ball FCBGA package. It is designed for applications that require substantial on-chip logic, embedded RAM, and a large number of I/O connections.

With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, 372 I/Os, industrial-grade operating temperature range, and a compact 780-FBGA (29×29) surface-mount package, this device targets designs where integration, robustness across -40 °C to 100 °C, and low-voltage core operation are important.

Key Features

• Core Logic Capacity  175,750 logic elements provide a substantial programmable fabric for complex digital designs and high-density implementations.
• Embedded Memory  Approximately 13.95 Mbits of on-chip RAM supports large buffering, FIFOs, and temporary data storage without external memory.
• I/O Count  372 I/O pins enable broad connectivity options for multi-channel interfaces, parallel buses, and mixed I/O requirements.
• Package & Mounting  780-BBGA / 780-FBGA (29×29) surface-mount package offers a high-pin-count, compact form factor suitable for dense board layouts.
• Power  Core voltage supply range from 870 mV to 930 mV for the device core, allowing designs that target low-voltage FPGA operation.
• Temperature & Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant construction supports regulatory requirements for lead-free assembly.

Typical Applications

• Telecommunications & Networking  Large logic capacity and numerous I/Os make the device suitable for packet processing, protocol bridging, and network infrastructure modules.
• Data Center & High-density Compute  Embedded RAM and high logic count support data buffering and custom accelerators used in compute and storage systems.
• Industrial Control & Automation  Industrial-grade temperature range and robust I/O count fit applications such as motion control, machine vision pre-processing, and process control interfaces.

Unique Advantages

• Highly integrated logic and memory: Combines 175,750 logic elements with approximately 13.95 Mbits of embedded RAM to reduce reliance on external components.
• Extensive I/O availability: 372 I/Os simplify board-level design for systems requiring many channels or high parallelism.
• Compact, high-density package: 780-FBGA (29×29) surface-mount footprint provides a dense pinout in a manageable PCB area.
• Industrial temperature capability: Rated from -40 °C to 100 °C for deployment in temperature-varied or industrial environments.
• Low-voltage core operation: 870 mV to 930 mV supply range supports designs targeting reduced core power envelopes.
• Manufacturer backing: Produced by Intel, offering traceable sourcing and product continuity from a major FPGA supplier.

Why Choose EP4SGX180DF29I4?

The EP4SGX180DF29I4 positions itself as a high-density, industrial-grade FPGA option for engineers who need a combination of large programmable logic capacity, substantial on-chip memory, and a high I/O count in a compact FCBGA package. Its operating range and RoHS compliance make it suitable for long-lived systems deployed in challenging environments.

This device is well suited for development teams building complex digital processing, networking, or industrial control systems that require scalable logic resources and reliable, low-voltage operation. Backed by Intel as the manufacturer, it offers a clear sourcing path for designs that demand long-term availability and consistency.

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