EP4SGX180FF35C2X
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA |
|---|---|
| Quantity | 254 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180FF35C2X – Stratix IV GX FPGA, 1152-FBGA (35×35)
The EP4SGX180FF35C2X is a Stratix® IV GX Field Programmable Gate Array supplied in a 1152‑FBGA (35×35) FCBGA package for surface-mount assembly. It combines a high logic capacity with abundant I/O and on-chip RAM to address demanding programmable logic tasks.
Documented as part of the Stratix IV family, the device is supported by comprehensive device handbook material covering core performance, transceiver performance, PLLs, DSP block specifications and TriMatrix memory block specifications. The device is RoHS‑compliant and graded for commercial use with an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic — 175,750 logic elements provide substantial capacity for complex custom logic and system integration.
- Embedded Memory — Approximately 14 Mbits of on‑chip RAM (13,954,048 bits) for buffering, packet memory and local data storage.
- I/O Density — 564 user I/O pins support broad interface connectivity and dense board-level integration.
- Power — Documented device supply range of 870 mV to 930 mV for core operation, enabling tight power budgeting in system designs.
- Package & Mounting — 1152‑FBGA (35×35) FCBGA package, surface‑mount mounting for high‑density board assembly.
- Thermal & Grade — Commercial grade device rated for 0 °C to 85 °C ambient operation.
- Stratix IV Family Capabilities — Device handbook sections for this family include transceiver performance, PLLs, DSP blocks and TriMatrix memory block specifications, reflecting the series’ documented support for advanced clocking, high‑speed I/O and DSP functions.
- Compliance — RoHS‑compliant construction.
Typical Applications
- High‑performance DSP and signal processing — Leverage the documented DSP block and TriMatrix memory capabilities in the Stratix IV family alongside 175,750 logic elements and ~14 Mbits of embedded RAM for compute‑intensive designs.
- High‑density interface and protocol bridging — 564 I/Os enable complex interface aggregation and protocol conversion in communications and data‑transport applications.
- Custom logic integration and prototyping — Large logic capacity and family‑level support for PLLs and clock trees make the device suitable for integrating bespoke logic, control and timing functions on a single FPGA.
Unique Advantages
- Significant logic capacity: 175,750 logic elements allow consolidation of multiple functions into a single device, reducing board complexity.
- Ample on‑chip memory: Approximately 14 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage requirements.
- High I/O count: 564 I/Os support a wide range of peripherals and high‑pin‑count interfaces without additional I/O expanders.
- Documented family features: Stratix IV device handbook coverage of transceivers, PLLs, DSP blocks and TriMatrix memory provides design guidance for high‑speed and compute‑oriented implementations.
- Commercial suitability and RoHS compliance: The 0 °C to 85 °C rating and RoHS‑compliant construction meet standard commercial product and environmental requirements.
- Compact assembly: 1152‑FBGA (35×35) FCBGA surface‑mount package supports compact, high‑density PCB designs.
Why Choose EP4SGX180FF35C2X?
EP4SGX180FF35C2X positions itself as a high‑capacity Stratix IV GX FPGA option for designs that require a large number of logic elements, substantial on‑chip RAM, and a high I/O count in a compact FCBGA package. Its documented family features—covering transceivers, DSP blocks, PLLs and memory block architecture—support development of complex timing, signal processing and high‑speed interface designs.
This device is suitable for teams and projects that need scalable programmable logic capacity, dense board integration and the design guidance provided by the Stratix IV device handbook. The combination of logic density, embedded memory and I/O resources supports consolidation of multi‑function systems onto a single FPGA, helping simplify BOMs and board layouts.
Request a quote or submit an inquiry to receive pricing and availability for EP4SGX180FF35C2X and to discuss how it fits your next FPGA design.

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