EP4SGX180FF35C3G

The EP4SGX180FF35C3G is an Intel Field Programmable Gate Array device from the Stratix IV device family. It delivers a high-density FPGA fabric with a large logic element count and extensive on‑chip memory, designed for applications that require high aggregate data bandwidth and flexible I/O integration.

Documented in the Stratix IV device handbook, the device family includes architecture and high‑speed transceiver features, embedded memory and DSP block support, and external memory interface capabilities described in the datasheet.

Key Features

• Core Logic Density  Provides 175,750 logic elements for complex logic implementation and high integration of custom functions.
• Embedded Memory  Approximately 14 Mbits of on‑chip RAM (13,954,048 total RAM bits) to support buffering, FIFOs, and local data storage.
• I/O Capacity  564 I/O pins to support wide parallel interfaces and extensive system-level connectivity.
• Stratix IV Family Features  Datasheet references include high‑speed transceiver features, DSP blocks, PLLs, and clock networks typical of the Stratix IV device family.
• Power  Core voltage supply range specified at 870 mV to 930 mV for the device core.
• Package and Mounting  1152‑ball FCBGA package (1152‑FBGA, 35×35) for surface‑mount assembly and compact board footprint.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑bandwidth communications and networking  Leveraging the Stratix IV device family’s high aggregate data bandwidth and high‑speed transceiver features for protocol and link implementations.
• Signal processing and DSP systems  On‑chip memory and the family’s DSP block support enable real‑time processing and algorithm acceleration.
• Memory interface and system integration  Embedded memory plus external memory interface capabilities support buffering and complex system integration tasks.

Unique Advantages

• High logic capacity: 175,750 logic elements allow integration of sizable custom logic without partitioning across multiple devices.
• Substantial embedded memory: Approximately 14 Mbits of on‑chip RAM reduces the need for external memory for many buffering and storage tasks.
• Large I/O complement: 564 I/O pins provide flexibility for wide parallel buses, control interfaces, and numerous peripherals.
• Compact FBGA packaging: 1152‑FBGA (35×35) provides a high‑pin‑count solution in a compact surface‑mount package suitable for dense PCBs.
• Low‑voltage core operation: Core supply range of 0.87 V to 0.93 V supports modern low‑voltage FPGA core architectures.
• Standards and compliance: RoHS compliance simplifies environmental regulatory considerations for product development.

Why Choose EP4SGX180FF35C3G?

The EP4SGX180FF35C3G positions itself as a high‑density Stratix IV FPGA option for designers who require significant logic resources, abundant embedded memory, and a large I/O complement in a compact FCBGA package. Its datasheet‑documented Stratix IV family features—including high‑speed transceiver capability, DSP support, and extensive clock and PLL resources—make it suitable for demanding data‑centric and signal‑processing applications.

For teams building complex FPGA‑based systems that demand scalability and integration, this device offers a combination of logic capacity, memory, and I/O that supports advanced designs while remaining within commercial operating conditions.

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