EP4SGX180FF35I3

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA

Quantity 244 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180FF35I3 – Stratix® IV GX FPGA, 175,750 logic elements, 564 I/O, 1152‑BBGA

The EP4SGX180FF35I3 is an Intel Stratix® IV GX field‑programmable gate array (FPGA) in a 1152‑BBGA (35 × 35) FCBGA package, designed for high‑capacity, high‑I/O embedded designs. It integrates a large programmable fabric with abundant on‑chip memory and transceiver‑oriented architecture elements described in the Stratix IV device handbook.

This device is targeted at applications that need substantial logic density, wide I/O counts and robust operating conditions, delivering a combination of performance, integration and industrial grade temperature support for demanding system designs.

Key Features

  • Logic Capacity — 175,750 logic elements provide significant programmable fabric for complex control, signal processing and protocol engines.
  • Logic Structure — Device-level architecture references Stratix IV GX family features such as high‑speed transceivers, DSP resources and flexible clocking and PLLs as described in the Stratix IV device handbook.
  • Embedded Memory — Approximately 13.95 Mbits of on‑chip RAM (13,954,048 total RAM bits) to support buffering, FIFOs and local data storage for DSP and packet processing tasks.
  • I/O and Package — 564 I/O pins in a 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35 × 35 mm) with surface‑mount mounting for high‑density board designs.
  • Power Supply — Core voltage range specified at 870 mV to 930 mV for device power planning and regulator selection.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
  • Mounting and Compliance — Surface mount package construction and RoHS compliance for lead‑free assembly and regulatory alignment.

Typical Applications

  • High‑bandwidth communications — Implement protocol engines and data aggregation using the device’s high I/O count and Stratix IV GX transceiver‑oriented architecture.
  • Digital signal processing — Use the large logic fabric and approximately 13.95 Mbits of embedded memory to build DSP pipelines, filters and accelerator blocks.
  • Network and packet processing — Support packet buffering, custom packet workflows and interface bridging with abundant logic and I/O resources.
  • Test & measurement and instrumentation — Leverage diagnostic features and flexible clocking described in the device handbook to implement measurement aggregation and system control functions.

Unique Advantages

  • High logic density: 175,750 logic elements enable large, complex designs without immediate need to partition across multiple devices.
  • Substantial on‑chip memory: Approximately 13.95 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑store use cases.
  • Extensive I/O capability: 564 I/O pins and a 1152‑BBGA package support dense external interfacing for multi‑lane, multi‑protocol systems.
  • Industrial operating range: Rated −40 °C to 100 °C for deployments in environments with extended temperature requirements.
  • Defined power envelope: Core supply range of 870 mV to 930 mV simplifies power budgeting and regulator selection for system designers.
  • Standards‑aware platform: Device is part of the Stratix IV GX family and aligns with the architecture and feature set documented in the Stratix IV device handbook for predictable integration.

Why Choose EP4SGX180FF35I3?

The EP4SGX180FF35I3 combines a high logic element count, substantial embedded memory and a large I/O complement in a surface‑mount 1152‑BBGA package, providing a compact yet capable platform for high‑bandwidth, compute‑intensive designs. Its Stratix IV GX family architecture and documented device handbook features make it suitable where integration of transceivers, DSP resources and flexible clocking are required.

This device is well suited to engineering teams building industrial‑grade communications, signal processing and system integration products that require robust operating temperature support, detailed device documentation and a predictable power and package footprint for production deployment.

Request a quote or submit an inquiry to evaluate EP4SGX180FF35I3 for your next design project.

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