EP4SGX180FF35I4

The EP4SGX180FF35I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel. This device provides 175,750 logic elements, approximately 14 Mbits of embedded memory, and 564 I/O pins in a 1152‑BBGA (35×35) FCBGA package for high-density programmable logic implementations.

Device documentation and the Stratix IV device handbook cover electrical and switching characteristics, power consumption, transceiver performance specifications, PLL and clock-tree details, DSP and TriMatrix memory block specifications, and configuration/JTAG information to support design and integration.

Key Features

• Core Capacity  175,750 logic elements offer substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 14 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive functions.
• I/O Density  564 user I/Os to accommodate wide parallel buses, multiple high-pin-count interfaces, and extensive peripheral connectivity.
• Package and Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35) with surface-mount mounting for compact, high-density board layouts.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match system power-rail design requirements.
• Industrial Temperature Range  Rated operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• Comprehensive Device Documentation  Datasheet and device handbook sections cover DC/switching characteristics, I/O standards, power, PLLs, DSP blocks, memory blocks, transceiver performance, and configuration/JTAG details.
• RoHS Compliant  Manufactured to comply with RoHS environmental standards.

Unique Advantages

• High integration density: 175,750 logic elements and extensive I/O reduce the need for multiple discrete devices and simplify complex system architectures.
• On-chip memory to minimize external components: Approximately 14 Mbits of embedded RAM helps lower BOM and PCB area by reducing external memory requirements.
• Designed for industrial deployments: Operating range from −40 °C to 100 °C and RoHS compliance support reliable operation in demanding environments.
• Compact, manufacturable package: 1152‑BBGA (35×35) FCBGA surface-mount package enables high-density board designs while supporting standard assembly processes.
• Power-flexible core: Narrow core voltage range (0.870–0.930 V) enables precise power-supply design and integration with system power management.
• Well-documented device family: The available device handbook and datasheet sections provide the electrical, timing, and configuration details needed for engineering validation and integration.

Why Choose EP4SGX180FF35I4?

The EP4SGX180FF35I4 positions itself as a high-density Stratix IV GX FPGA option for designers needing large programmable logic capacity, substantial on-chip memory, and a high I/O count in a compact FCBGA package. Its documented electrical characteristics, transceiver and DSP block specifications, and configuration/JTAG details provide the technical foundation required for system-level integration and verification.

This device is suited for development teams and procurement groups targeting industrial-grade FPGA solutions that require scalability of logic resources, robust I/O connectivity, and controlled power characteristics, backed by comprehensive device documentation.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the EP4SGX180FF35I4. Our team can assist with part selection and provide the technical details you need to move forward with procurement or design evaluation.