EP4SGX180HF35C2N

The EP4SGX180HF35C2N is an Intel Stratix IV GX Field Programmable Gate Array (FPGA) supplied in a 1152-pin FBGA package. It combines a large logic fabric, substantial on-chip embedded memory, and extensive I/O to support demanding programmable logic applications.

Key technical highlights include 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 564 I/Os. The device supports low-voltage core operation (870 mV–930 mV), is RoHS compliant, and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic — 175,750 logic elements provide a high-capacity fabric for complex custom logic, state machines, and control functions.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O Density — 564 I/O pins enable wide external connectivity for parallel buses, memory interfaces, and high-pin-count system designs.
• Power — Core voltage supply range of 870 mV to 930 mV to match system power architectures and regulator choices.
• Package & Mounting — Available in a 1152-FBGA (35×35) supplier package; package case listed as 1152-BBGA, FCBGA, with surface-mount mounting type for standard PCB assembly.
• Operating Range — Commercial-grade device rated from 0 °C to 85 °C for typical industrial and commercial environments.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly and environmental directives.
• Architectural Features (series) — Stratix IV GX family documentation highlights elements such as high-speed transceiver features, external memory interface support, DSP blocks, PLLs, and extensive clock networks.

Typical Applications

• High-speed serial links and protocol bridging — The Stratix IV GX family design emphasis on high-speed transceivers and protocol support makes this device suitable for designs requiring multi-protocol data transport and aggregation.
• External memory interfaces — Large I/O count and embedded memory capacity support designs that interface to external DRAM or fast memory subsystems for buffering and high-throughput data movement.
• Signal processing and DSP — Substantial logic and on-chip RAM are suited to implement DSP pipelines, custom accelerators, and real-time data path logic.

Unique Advantages

• High logic capacity: 175,750 logic elements enable implementation of complex algorithms and large-scale state machines without partitioning across multiple devices.
• Significant embedded memory: Approximately 13.95 Mbits of on-chip RAM reduces dependence on external memory for many buffering and scratchpad needs, simplifying board design.
• Extensive I/O: 564 I/Os give flexibility to connect wide buses, multiple peripherals, or parallel memory interfaces directly to the FPGA fabric.
• Commercial-grade specification: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial and enterprise applications.
• Standard surface-mount packaging: 1152-FBGA (35×35) package supports established PCB assembly processes and dense board integration.
• Core voltage compatibility: 870 mV–930 mV supply range fits modern low-voltage power domains for efficient system power design.

Why Choose EP4SGX180HF35C2N?

The EP4SGX180HF35C2N positions itself as a high-capacity Stratix IV GX FPGA offering a sizable logic fabric, abundant embedded memory, and a large I/O count for demanding programmable designs. Its power and package specifications are suited to dense, performance-oriented boards where on-chip resources reduce external component count.

This device is appropriate for engineering teams building complex data-paths, protocol bridges, or DSP-accelerated systems who require a commercially graded, RoHS-compliant FPGA with a robust feature set and a broad tool and documentation base from the Stratix IV family.

Request a quote or submit a procurement inquiry to begin evaluating EP4SGX180HF35C2N for your next design.