EP4SGX180HF35C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 302 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180HF35C3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX180HF35C3G is an Intel Stratix IV family FPGA tailored for high-density, system-level integration. This commercial-grade, surface-mount device provides a large logic fabric, plentiful I/O, and embedded memory to support complex custom logic, high-speed interfaces, and system integration tasks.
With 175,750 logic elements, approximately 13.95 Mbits of on-chip RAM, and 564 I/Os in a 1152-ball FCBGA package, the device is suited to applications requiring substantial programmable logic capacity combined with broad interfacing capability. The device operates across a supply window of 870 mV to 930 mV and an ambient range of 0 °C to 85 °C.
Key Features
- Core Logic Provides 175,750 logic elements for implementing large-scale custom logic, state machines, and protocol engines.
- Embedded Memory Approximately 13.95 Mbits of on-chip RAM (13,954,048 bits) to support FIFOs, buffers, and local data storage without external memory.
- I/O Density 564 user I/Os to connect multiple external devices, buses, and high-speed interfaces directly to the FPGA fabric.
- Package & Mounting Available in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35x35)), optimized for surface-mount assembly.
- Power Supply Specified core supply range from 870 mV to 930 mV to match targeted power and performance operating points.
- Operating Conditions Commercial-grade device rated for 0 °C to 85 °C ambient operation.
- Stratix IV Family Part of the Stratix IV device family, offering architecture features such as FPGA fabric, embedded memory, DSP blocks, clock networks, PLLs, and high-speed I/O support as documented in the device handbook.
Typical Applications
- High-speed communications Use the device’s large logic capacity and I/O count to implement protocol engines, interface bridging, and packet processing functions.
- Data processing & acceleration Leverage abundant logic elements and embedded memory to offload compute kernels and buffering for specialized data-paths.
- Memory-interface controllers Deploy the Stratix IV architecture’s external memory interface capabilities to build custom controllers and memory bridges.
- Prototyping and system integration Employ the device for board-level prototyping, validation of custom silicon functions, and integration of multiple subsystems on a single FPGA fabric.
Unique Advantages
- High logic capacity: 175,750 logic elements let you implement large, complex designs without immediate partitioning across multiple devices.
- Significant on-chip memory: Approximately 13.95 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
- Extensive I/O resources: 564 I/Os provide flexibility for multi-channel interfaces, board-level connectivity, and parallel data paths.
- Standard surface-mount packaging: 1152-BBGA / 1152-FBGA (35x35) packaging supports compact, production-ready board layouts.
- Commercial operating range: Specified 0 °C to 85 °C ambient and defined supply window (870 mV–930 mV) enable predictable behavior across typical commercial deployments.
- Documented Stratix IV architecture: Backed by the Stratix IV device handbook for architecture-level guidance on fabric, DSP, clocking, and I/O features.
Why Choose EP4SGX180HF35C3G?
The EP4SGX180HF35C3G positions itself as a high-capacity Stratix IV FPGA for designs that demand substantial programmable logic, robust embedded memory, and broad I/O connectivity in a production-ready surface-mount package. Its commercial-grade operating range and clearly specified supply requirements make it appropriate for mainstream communications, data processing, and system integration projects.
Design teams and integrators seeking scalable, well-documented FPGA silicon can deploy this device where large logic density and on-chip memory reduce BOM complexity and accelerate time-to-system verification while leveraging the Stratix IV architecture guidance for implementation.
Request a quote or submit an inquiry to receive pricing and availability details for the EP4SGX180HF35C3G and to discuss how this Stratix IV FPGA can fit into your next design.

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