EP4SGX180HF35C3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA |
|---|---|
| Quantity | 38 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180HF35C3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC
The EP4SGX180HF35C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) packaged in a 1152-BBGA (35 × 35) FCBGA. It delivers substantial programmable logic capacity, abundant I/O, and on-chip embedded memory for complex digital designs.
With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 564 I/O pins, this commercial-grade, RoHS-compliant device targets applications that require high integration of logic, memory and high-speed serial/transceiver-enabled functions as described in the device datasheet.
Key Features
- Programmable Fabric — 175,750 logic elements to implement large-scale custom logic, control paths and glue logic within a single device.
- Embedded Memory — Approximately 13.95 Mbits of on-chip RAM suitable for buffers, FIFOs and local data storage.
- I/O and Package — 564 I/O pins in a 1152-FBGA (35 × 35) surface-mount package (1152-BBGA, FCBGA) to support wide external connectivity and dense board integration.
- High-Speed Transceiver and DSP Capabilities — Device handbook sections cover transceiver performance, DSP block specifications and TriMatrix memory block specifications, enabling complex signal processing and serial link implementations.
- Clocking and Timing — Integrated clock-tree and PLL specifications in the device documentation allow for flexible clock management and synchronized system timing.
- Power and Operating Conditions — Supported core voltage supply range of 870 mV to 930 mV and recommended operating conditions, with datasheet sections covering DC characteristics and power consumption for design planning.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for standard commercial deployments.
- Standards and Testability — Configuration and JTAG specifications included in the device handbook provide standard configuration and debug interfaces.
- Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- High-performance data processing — Implement compute-intensive logic and DSP pipelines using the device's large logic and embedded memory resources.
- High-speed serial communications — Use the documented transceiver and clocking features to implement serial links and protocol engines requiring many I/O and precise timing.
- Prototyping and system integration — Consolidate multiple functions into a single FPGA to reduce component count and accelerate design iterations.
Unique Advantages
- Large logic capacity: 175,750 logic elements enable consolidation of complex digital subsystems and reduce the need for multiple discrete devices.
- Substantial on-chip memory: Approximately 13.95 Mbits of embedded RAM support large buffering and local data storage without external memory dependencies.
- High I/O density: 564 I/O pins in a 1152-FBGA package provide flexibility for wide parallel interfaces and multiple high-speed lanes.
- Comprehensive device documentation: Datasheet and device handbook sections covering transceivers, DSP blocks, PLLs, clock tree and configuration simplify design verification and system integration.
- Surface-mount, high-density packaging: 1152-BBGA (FCBGA) package enables compact board layouts and automated assembly.
- Regulatory readiness: RoHS compliance supports constrained-environment manufacturing requirements.
Why Choose EP4SGX180HF35C3N?
The EP4SGX180HF35C3N positions itself as a highly integrated Stratix IV GX FPGA option for commercial designs that require extensive programmable logic, embedded memory and significant I/O resources in a single surface-mount package. Its documented transceiver, DSP and clocking capabilities support integration of complex signal processing and high-speed communication functions.
This device is well suited for engineering teams looking to consolidate functionality, shorten system-level BOMs and leverage comprehensive datasheet guidance for design and verification. Its combination of logic capacity, embedded memory and package density offers a scalable solution for advanced FPGA-based designs.
Request a quote or submit a procurement inquiry to evaluate EP4SGX180HF35C3N for your next design.

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