EP4SGX180HF35C3N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA

Quantity 38 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180HF35C3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC

The EP4SGX180HF35C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) packaged in a 1152-BBGA (35 × 35) FCBGA. It delivers substantial programmable logic capacity, abundant I/O, and on-chip embedded memory for complex digital designs.

With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 564 I/O pins, this commercial-grade, RoHS-compliant device targets applications that require high integration of logic, memory and high-speed serial/transceiver-enabled functions as described in the device datasheet.

Key Features

  • Programmable Fabric — 175,750 logic elements to implement large-scale custom logic, control paths and glue logic within a single device.
  • Embedded Memory — Approximately 13.95 Mbits of on-chip RAM suitable for buffers, FIFOs and local data storage.
  • I/O and Package — 564 I/O pins in a 1152-FBGA (35 × 35) surface-mount package (1152-BBGA, FCBGA) to support wide external connectivity and dense board integration.
  • High-Speed Transceiver and DSP Capabilities — Device handbook sections cover transceiver performance, DSP block specifications and TriMatrix memory block specifications, enabling complex signal processing and serial link implementations.
  • Clocking and Timing — Integrated clock-tree and PLL specifications in the device documentation allow for flexible clock management and synchronized system timing.
  • Power and Operating Conditions — Supported core voltage supply range of 870 mV to 930 mV and recommended operating conditions, with datasheet sections covering DC characteristics and power consumption for design planning.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for standard commercial deployments.
  • Standards and Testability — Configuration and JTAG specifications included in the device handbook provide standard configuration and debug interfaces.
  • Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • High-performance data processing — Implement compute-intensive logic and DSP pipelines using the device's large logic and embedded memory resources.
  • High-speed serial communications — Use the documented transceiver and clocking features to implement serial links and protocol engines requiring many I/O and precise timing.
  • Prototyping and system integration — Consolidate multiple functions into a single FPGA to reduce component count and accelerate design iterations.

Unique Advantages

  • Large logic capacity: 175,750 logic elements enable consolidation of complex digital subsystems and reduce the need for multiple discrete devices.
  • Substantial on-chip memory: Approximately 13.95 Mbits of embedded RAM support large buffering and local data storage without external memory dependencies.
  • High I/O density: 564 I/O pins in a 1152-FBGA package provide flexibility for wide parallel interfaces and multiple high-speed lanes.
  • Comprehensive device documentation: Datasheet and device handbook sections covering transceivers, DSP blocks, PLLs, clock tree and configuration simplify design verification and system integration.
  • Surface-mount, high-density packaging: 1152-BBGA (FCBGA) package enables compact board layouts and automated assembly.
  • Regulatory readiness: RoHS compliance supports constrained-environment manufacturing requirements.

Why Choose EP4SGX180HF35C3N?

The EP4SGX180HF35C3N positions itself as a highly integrated Stratix IV GX FPGA option for commercial designs that require extensive programmable logic, embedded memory and significant I/O resources in a single surface-mount package. Its documented transceiver, DSP and clocking capabilities support integration of complex signal processing and high-speed communication functions.

This device is well suited for engineering teams looking to consolidate functionality, shorten system-level BOMs and leverage comprehensive datasheet guidance for design and verification. Its combination of logic capacity, embedded memory and package density offers a scalable solution for advanced FPGA-based designs.

Request a quote or submit a procurement inquiry to evaluate EP4SGX180HF35C3N for your next design.

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