EP4SGX180HF35C3

The EP4SGX180HF35C3 is a Stratix® IV GX field programmable gate array (FPGA) IC designed for commercial applications that require large logic capacity, substantial on-chip memory, and high I/O density. Its architecture delivers a combination of 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 564 user I/Os to support complex digital designs.

Packaged in a 1152-ball FCBGA (35 × 35 mm) surface-mount package and RoHS compliant, this device targets designers building high-density, memory-rich, and I/O-intensive systems operating in standard commercial temperature environments.

Key Features

• Logic Capacity  Provides 175,750 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory  Includes approximately 13.95 Mbits of on-chip RAM for buffering, LUT-based storage, and state retention within complex designs.
• I/O Density  Offers 564 user I/Os to support wide parallel data paths, multiple high-speed interfaces, and extensive external connectivity.
• Power  Core supply range specified between 870 mV and 930 mV for the device operating point.
• Package and Mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) designed for surface-mount assembly in compact system layouts.
• Operating Conditions  Commercial-grade operation over a 0 °C to 85 °C ambient temperature range and RoHS compliance for environmental regulatory alignment.

Typical Applications

• High-density digital processing  Implement large custom datapaths and control logic where significant logic elements and embedded RAM are required.
• Network and communications equipment  Support packet processing and interface aggregation using the device’s high I/O count and on-chip memory.
• Video and imaging systems  Enable frame buffering, pixel processing, and parallel pipelines leveraging the abundant embedded memory and logic resources.
• Prototyping and complex system integration  Use as a platform for consolidating multiple functions into a single FPGA for proof-of-concept and pre-ASIC development.

Unique Advantages

• Large logic resource pool: 175,750 logic elements allow designers to integrate complex state machines, DSP blocks, and control logic within one device.
• Substantial on-chip memory: Approximately 13.95 Mbits of RAM reduces dependency on external memory for many buffering and storage needs.
• High I/O scalability: 564 user I/Os provide flexibility for interfacing multiple peripherals and wide data buses without extensive external multiplexing.
• Compact, board-friendly package: 1152-ball FCBGA (35 × 35 mm) surface-mount package supports dense PCB layouts while maintaining robust connectivity.
• Commercial operating profile and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial deployment requirements.
• Defined core supply range: Core voltage specified between 870 mV and 930 mV to guide power-supply design and sequencing.

Why Choose EP4SGX180HF35C3?

The EP4SGX180HF35C3 is positioned for designers who need a high-capacity FPGA with significant embedded memory and extensive I/O in a compact FCBGA package. Its combination of 175,750 logic elements, approximately 13.95 Mbits of on-chip RAM, and 564 I/Os makes it suitable for complex digital, communications, and imaging systems within commercial temperature environments.

Selecting this device offers a pathway to consolidate multiple functions into a single programmable device while adhering to RoHS requirements and standard commercial operating conditions—helpful for teams focused on scaling functionality without expanding board-level complexity.

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