EP4SGX180HF35C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA |
|---|---|
| Quantity | 540 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180HF35C2 – Stratix® IV GX FPGA, 175,750 logic elements, 564 I/Os
The EP4SGX180HF35C2 is a Stratix IV GX field‑programmable gate array (FPGA) in a 1152‑FBGA surface‑mount package, offering a high‑density logic fabric with on‑chip memory and extensive I/O. It is built on the Stratix IV device family architecture and is targeted at designs that require large programmable logic capacity paired with high aggregate data bandwidth and protocol flexibility.
This device suits commercial‑grade systems that need substantial logic resources, abundant I/O, and integrated memory while operating within a 0 °C to 85 °C range and a core voltage supply window of 870 mV to 930 mV.
Key Features
- Logic Capacity 175,750 logic elements (LEs) provide large programmable fabric for complex digital functions and system integration.
- Embedded Memory Approximately 14 Mbits of on‑chip RAM (13,954,048 bits) for buffering, packet storage, and large state machines.
- I/O Density 564 user I/Os to connect multiple external interfaces, memory banks, and peripherals in compact systems.
- High‑Speed Fabric Features Part of the Stratix IV GX family with architecture sections in the device handbook referencing high‑speed transceivers, DSP blocks, PLLs, and clock networks for bandwidth‑oriented designs.
- Package and Mounting 1152‑FBGA (35×35) / 1152‑BBGA, FCBGA surface‑mount package to support compact board layouts and high‑pin‑count routing.
- Power and Voltage Core voltage supply range of 870 mV to 930 mV, enabling operation within the specified power envelope for the device.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial applications.
- RoHS Compliance RoHS‑compliant material composition for environmental and manufacturing requirements.
Typical Applications
- High‑speed communications Protocol bridging and packet processing where wide protocol support and aggregate bandwidth are required.
- Data‑plane and networking equipment Switching, routing, and line‑card functions that leverage large logic capacity and numerous I/Os for external interfaces.
- Video and imaging systems Frame buffering and stream processing using the device’s embedded RAM and abundant logic resources.
- High‑performance test and measurement Custom signal processing and control where deterministic logic and on‑chip memory simplify system design.
Unique Advantages
- Large programmable capacity: 175,750 logic elements enable consolidation of multiple functions onto a single FPGA, reducing board‑level complexity.
- Substantial on‑chip memory: Approximately 14 Mbits of embedded RAM supports deep buffering and large state storage without external memory in some use cases.
- Extensive connectivity: 564 I/Os allow flexible interfacing to external devices, memory, and transceivers for complex system interconnects.
- Compact, high‑pin package: 1152‑FBGA (35×35) surface‑mount package facilitates high‑density routing and compact PCB implementation.
- Targeted for bandwidth applications: Part of the Stratix IV GX family with architecture features oriented to high‑speed transceivers, DSP resources, and clocking, supporting designs that require high aggregate throughput.
- Compliance and temperature assured: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align the device with standard commercial manufacturing requirements.
Why Choose EP4SGX180HF35C2?
The EP4SGX180HF35C2 positions itself as a high‑density Stratix IV GX FPGA suitable for commercial systems that demand substantial logic, memory, and I/O in a single package. Its combination of 175,750 logic elements, approximately 14 Mbits of embedded RAM, and 564 I/Os offers designers the integration needed to reduce external components and simplify board design.
Designed within the Stratix IV device family architecture, the EP4SGX180HF35C2 addresses bandwidth‑oriented designs and applications that require flexible protocol support and advanced fabric features, while meeting commercial temperature and RoHS requirements.
Request a quote or contact our sales team to discuss availability, pricing, and how EP4SGX180HF35C2 can fit your next design.

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