EP4SGX180HF35C2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 281 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180HF35C2G – Field Programmable Gate Array (FPGA) IC
The EP4SGX180HF35C2G is a commercial-grade FPGA IC from the Stratix IV device family. It provides a high-density programmable fabric with a substantial logic element count and embedded memory suited for demanding digital designs.
Typical use cases include high-bandwidth data processing, protocol bridging and external-memory interfacing where on-chip logic density, large embedded memory and advanced I/O features are required. The device pairs extensive logic and memory resources with Stratix IV family architectural features such as high-speed transceivers, DSP support and flexible clocking.
Key Features
- Core Logic Approximately 175,750 logic elements, delivering a large programmable fabric for complex digital functions.
- Embedded Memory Approximately 13.95 Mbits of on-chip RAM to support buffering, packet queues and local data storage.
- I/O Capacity 564 I/O pins to support wide external interfacing and multiple peripheral connections.
- High-Speed Transceivers & Protocol Support Stratix IV family documentation highlights high-speed transceiver features and a wide range of protocol support for high-aggregate bandwidth designs.
- DSP and Timing Resources Architecture-level support for digital signal processing blocks, PLLs and comprehensive clock networks for synchronous system design.
- Package & Mounting Available in 1152-BBGA / FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type.
- Power Specified core supply range of 870 mV to 930 mV for device operation.
- Commercial Temperature & Compliance Operating temperature range 0 °C to 85 °C; RoHS compliant.
- Diagnostic & Signal Integrity Features Stratix IV family documentation cites diagnostic features and signal-integrity mechanisms to assist system integration and debugging.
Typical Applications
- High-speed communications Leverage the Stratix IV transceiver and protocol support to implement line cards, protocol gateways and packet-processing functions.
- External memory interfaces Use the device’s logic density and I/O capacity to implement controllers and bridges for external DRAM and storage subsystems.
- Digital signal processing Combine large embedded memory with DSP block support for filtering, aggregation and real-time data processing tasks.
- System integration & prototyping Ideal for complex system prototypes that require extensive on-chip logic, flexible clocking and comprehensive I/O.
Unique Advantages
- High-density programmable fabric: Approximately 175,750 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
- Substantial on-chip memory: Approximately 13.95 Mbits of embedded RAM supports large buffers and reduces dependence on external memory for many functions.
- Extensive I/O bandwidth: 564 I/Os accommodate wide data buses and numerous peripherals without additional multiplexing circuitry.
- Stratix IV family features: Built on a device family that provides high-speed transceivers, DSP capabilities and advanced clock/PLL resources to address demanding system requirements.
- Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
- Compact surface-mount packaging: 1152-ball FBGA packaging (35×35) supports dense designs while enabling automated assembly.
Why Choose EP4SGX180HF35C2G?
The EP4SGX180HF35C2G positions itself as a high-density Stratix IV FPGA option for engineers who need significant logic resources and on-chip memory alongside advanced family-level features such as high-speed transceivers, DSP support and flexible clocking. Its combination of logic capacity, memory and I/O makes it suitable for systems that demand integrated data processing and protocol handling.
This commercial-grade device is appropriate for design teams building high-bandwidth communications equipment, memory interface controllers, and complex signal-processing systems where scalability, on-chip resource integration and vendor-backed device family documentation are important considerations.
Request a quote or submit a request for pricing and availability for EP4SGX180HF35C2G to begin integrating this Stratix IV FPGA into your next design.

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