EP4SGX180HF35C2G

IC FPGA 564 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 281 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180HF35C2G – Field Programmable Gate Array (FPGA) IC

The EP4SGX180HF35C2G is a commercial-grade FPGA IC from the Stratix IV device family. It provides a high-density programmable fabric with a substantial logic element count and embedded memory suited for demanding digital designs.

Typical use cases include high-bandwidth data processing, protocol bridging and external-memory interfacing where on-chip logic density, large embedded memory and advanced I/O features are required. The device pairs extensive logic and memory resources with Stratix IV family architectural features such as high-speed transceivers, DSP support and flexible clocking.

Key Features

  • Core Logic  Approximately 175,750 logic elements, delivering a large programmable fabric for complex digital functions.
  • Embedded Memory  Approximately 13.95 Mbits of on-chip RAM to support buffering, packet queues and local data storage.
  • I/O Capacity  564 I/O pins to support wide external interfacing and multiple peripheral connections.
  • High-Speed Transceivers & Protocol Support  Stratix IV family documentation highlights high-speed transceiver features and a wide range of protocol support for high-aggregate bandwidth designs.
  • DSP and Timing Resources  Architecture-level support for digital signal processing blocks, PLLs and comprehensive clock networks for synchronous system design.
  • Package & Mounting  Available in 1152-BBGA / FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type.
  • Power  Specified core supply range of 870 mV to 930 mV for device operation.
  • Commercial Temperature & Compliance  Operating temperature range 0 °C to 85 °C; RoHS compliant.
  • Diagnostic & Signal Integrity Features  Stratix IV family documentation cites diagnostic features and signal-integrity mechanisms to assist system integration and debugging.

Typical Applications

  • High-speed communications  Leverage the Stratix IV transceiver and protocol support to implement line cards, protocol gateways and packet-processing functions.
  • External memory interfaces  Use the device’s logic density and I/O capacity to implement controllers and bridges for external DRAM and storage subsystems.
  • Digital signal processing  Combine large embedded memory with DSP block support for filtering, aggregation and real-time data processing tasks.
  • System integration & prototyping  Ideal for complex system prototypes that require extensive on-chip logic, flexible clocking and comprehensive I/O.

Unique Advantages

  • High-density programmable fabric: Approximately 175,750 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 13.95 Mbits of embedded RAM supports large buffers and reduces dependence on external memory for many functions.
  • Extensive I/O bandwidth: 564 I/Os accommodate wide data buses and numerous peripherals without additional multiplexing circuitry.
  • Stratix IV family features: Built on a device family that provides high-speed transceivers, DSP capabilities and advanced clock/PLL resources to address demanding system requirements.
  • Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
  • Compact surface-mount packaging: 1152-ball FBGA packaging (35×35) supports dense designs while enabling automated assembly.

Why Choose EP4SGX180HF35C2G?

The EP4SGX180HF35C2G positions itself as a high-density Stratix IV FPGA option for engineers who need significant logic resources and on-chip memory alongside advanced family-level features such as high-speed transceivers, DSP support and flexible clocking. Its combination of logic capacity, memory and I/O makes it suitable for systems that demand integrated data processing and protocol handling.

This commercial-grade device is appropriate for design teams building high-bandwidth communications equipment, memory interface controllers, and complex signal-processing systems where scalability, on-chip resource integration and vendor-backed device family documentation are important considerations.

Request a quote or submit a request for pricing and availability for EP4SGX180HF35C2G to begin integrating this Stratix IV FPGA into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up