EP4SGX180FF35I3N

The EP4SGX180FF35I3N is a Stratix IV GX family FPGA offering a high-logic capacity fabric in a compact FCBGA package. As a member of the Stratix IV GX device family, it provides a combination of large logic resources, substantial embedded memory, and a high I/O count for designs that require dense digital integration.

Measured specifications such as 175,750 logic elements, approximately 14 Mbits of embedded RAM, 564 I/O pins, and an industrial operating range make this device appropriate for applications that demand high integration, significant on-chip memory, and robust temperature tolerance.

Key Features

• Core Logic  175,750 logic elements to implement complex digital functions, large state machines, and custom compute pipelines.
• Embedded Memory  13,954,048 bits of on-chip RAM (approximately 14 Mbits) for frame buffers, FIFOs, and on-chip data storage.
• I/O Density  564 user I/O pins to connect to multiple external devices, memory interfaces, and parallel buses.
• Stratix IV GX Architecture  Device is part of the Stratix IV GX family as documented in the device handbook, including architecture and high-speed transceiver features described for the series.
• Power and Voltage  Core supply range of 870 mV to 930 mV, enabling defined power budgeting and system-level power planning.
• Package & Mounting  1152-BBGA / 1152-FBGA (35×35) FCBGA package; surface-mount device suitable for board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support industrial-temperature deployments.
• Compliance  RoHS-compliant component suitable for environmentally regulated designs.

Typical Applications

• High-bandwidth communications equipment  Large logic capacity, significant on-chip RAM and the Stratix IV GX architecture support dense protocol handling and data path processing.
• Network and packet processing  High I/O count and abundant logic elements enable implementation of hardware packet engines, buffering, and classification functions.
• Video and imaging systems  On-chip RAM and large logic resources allow frame buffering, format conversion, and real-time pipeline processing.
• Industrial control and instrumentation  Industrial temperature rating and surface-mount FCBGA packaging make the device suitable for robust embedded control and data acquisition systems.

Unique Advantages

• High integration density: 175,750 logic elements and substantial embedded RAM reduce the need for external processors and memory, simplifying system BOMs.
• Extensive I/O capability: 564 I/O pins provide flexible interfacing options for parallel and serial peripherals, sensors, and memory devices.
• Industrial-ready temperature range: −40 °C to 100 °C operation supports deployment in environments with wide temperature swings.
• Compact package footprint: 1152-BBGA / 1152-FBGA (35×35) FCBGA package balances high pin count with a manageable board area for dense designs.
• Design predictability: Defined core voltage range (870–930 mV) and documented family architecture enable consistent power and timing planning.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose EP4SGX180FF35I3N?

The EP4SGX180FF35I3N positions itself for designs that need a high logic element count, significant embedded RAM, and broad I/O capability in a single FPGA package. Its Stratix IV GX family heritage and documented device handbook content align the part with architectures that include high-speed transceiver and bandwidth-oriented features described for the series.

This device is suited to engineering teams developing network, video, and industrial systems that require on-chip memory, dense logic implementation, and operation across an industrial temperature range. The combination of package density, electrical specifications, and RoHS compliance supports long-term platform designs where integration and predictable power behavior matter.

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