EP4SGX180FF35C4

The EP4SGX180FF35C4 is a Stratix® IV GX FPGA providing a high logic-count programmable fabric in a 1152-ball fine-pitch BGA package. It combines abundant logic resources, substantial on-chip RAM, and a large I/O complement for complex digital designs.

Targeted at applications that require high logic density, embedded memory capacity, and extensive I/O, this commercial-grade device operates from 0 °C to 85 °C and supports a core supply range of 870 mV to 930 mV.

Key Features

• Core logic density — 175,750 logic elements provide a large programmable fabric for complex RTL implementations and system integration.
• Embedded memory — Approximately 13.95 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive algorithms.
• I/O and connectivity — 564 user I/Os enable wide parallel interfacing and extensive board-level connectivity.
• Transceiver and DSP architecture — Documented transceiver performance and DSP block specifications in the device handbook indicate integrated resources for high-speed serial datapaths and signal processing.
• Power and supply — Core voltage operation specified between 870 mV and 930 mV for compatible power-rail design.
• Package and mounting — 1152-ball FBGA (35 × 35 mm) package, surface-mountable, suitable for dense PCB integration.
• Operating conditions and grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• RoHS compliant — Environmentally compliant for lead-free manufacturing processes.

Typical Applications

• High-performance DSP systems — Leverage the device’s DSP block specifications and large logic element count for algorithm acceleration and real-time signal processing.
• High-speed serial and transceiver-based designs — Use documented transceiver performance specifications to implement serial links and high-throughput datapaths.
• Memory-intensive logic — Approximately 13.95 Mbits of on-chip RAM supports buffering, packet processing, and large state machines without external memory in some use cases.
• Complex control and I/O interfacing — 564 I/Os enable dense peripheral connectivity for system control, sensor aggregation, and custom bus interfaces.

Unique Advantages

• High logic capacity: 175,750 logic elements enable integration of multiple system functions into one device, reducing board-level component count.
• Substantial on-chip memory: Approximately 13.95 Mbits of embedded RAM simplifies designs that require local buffering or large lookup tables.
• Extensive I/O: 564 user I/Os provide flexibility to support parallel interfaces, multiple peripherals, and board-level routing options.
• Integrated transceiver and DSP resources: Documented transceiver and DSP block specifications support implementation of high-speed datapaths and signal-processing functions.
• Compact, production-ready package: 1152-FBGA (35 × 35) surface-mount package supports high-density PCB designs and automated assembly.
• Regulated operating range and compliance: Commercial operating range (0 °C to 85 °C), 870–930 mV supply window, and RoHS compliance support mainstream production requirements.

Why Choose EP4SGX180FF35C4?

The EP4SGX180FF35C4 balances large-scale logic capacity, substantial embedded memory, and a broad I/O footprint in a single Stratix IV GX FPGA package. Its documented device handbook and datasheet content outline transceiver, DSP, clocking, and core characteristics that help engineers evaluate system-level performance and integration trade-offs.

This device is well-suited for designers building complex digital systems that require on-chip RAM, numerous I/Os, and integrated high-speed datapath resources. Its commercial-grade operating range and RoHS compliance make it appropriate for production deployments that adhere to standard temperature and environmental requirements.

Request a quote or submit a pricing and availability inquiry to evaluate EP4SGX180FF35C4 for your next design.