EP4SGX180FF35C3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA |
|---|---|
| Quantity | 772 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180FF35C3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC
The EP4SGX180FF35C3N is a Stratix® IV GX Field Programmable Gate Array provided in a 1152-BBGA FCBGA package. This commercial-grade FPGA integrates 175,750 logic elements, approximately 14 Mbits of embedded memory, and 564 I/O pins to support complex, high-density digital designs within a surface-mount 1152-FBGA (35×35) footprint.
Designed for applications that require substantial on-chip logic and memory capacity while operating within a commercial temperature range (0 °C to 85 °C), the device accepts a core supply voltage between 870 mV and 930 mV and is RoHS compliant.
Key Features
- Logic Capacity 175,750 logic elements provide large-scale programmable logic resources for complex implementations.
- Embedded Memory Approximately 14 Mbits of on-chip RAM to support buffering, lookup tables, and local storage needs.
- I/O Density 564 available I/O pins to support extensive interfacing and system-level connectivity.
- Package 1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
- Power Core supply voltage specified from 870 mV to 930 mV to match system power-rail requirements.
- Operating Conditions & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant for environmental requirements.
Unique Advantages
- High logic integration: 175,750 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
- Significant embedded memory: Approximately 14 Mbits of on-chip RAM supports data buffering and fast local storage without external memory in many use cases.
- Extensive I/O capability: 564 I/O pins provide flexibility for complex interfaces and multiple high-pin-count peripherals.
- Compact surface-mount package: 1152-FBGA (35×35) package enables high-density PCB layouts while maintaining robust electrical connections.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation to match general-purpose electronics and commercial deployments.
- RoHS compliant: Meets regulatory requirements for restricted substances in electronic assemblies.
Why Choose EP4SGX180FF35C3N?
The EP4SGX180FF35C3N offers a balanced combination of high logic element count, substantial embedded memory, and a large number of I/Os in a compact surface-mount FBGA package. Its electrical and thermal specifications—core voltage range of 870 mV to 930 mV and a 0 °C to 85 °C operating range—make it suitable for commercial designs that require dense on-chip resources and flexible interfacing.
This device is well suited to engineers and teams seeking to consolidate functionality onto a single FPGA to simplify board design, reduce bill of materials, and support complex programmable logic requirements within commercial-temperature applications.
Request a quote or submit an inquiry for pricing and availability for EP4SGX180FF35C3N to receive a customized response for your project requirements.

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