EP4SGX180FF35C3N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA

Quantity 772 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180FF35C3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC

The EP4SGX180FF35C3N is a Stratix® IV GX Field Programmable Gate Array provided in a 1152-BBGA FCBGA package. This commercial-grade FPGA integrates 175,750 logic elements, approximately 14 Mbits of embedded memory, and 564 I/O pins to support complex, high-density digital designs within a surface-mount 1152-FBGA (35×35) footprint.

Designed for applications that require substantial on-chip logic and memory capacity while operating within a commercial temperature range (0 °C to 85 °C), the device accepts a core supply voltage between 870 mV and 930 mV and is RoHS compliant.

Key Features

  • Logic Capacity 175,750 logic elements provide large-scale programmable logic resources for complex implementations.
  • Embedded Memory Approximately 14 Mbits of on-chip RAM to support buffering, lookup tables, and local storage needs.
  • I/O Density 564 available I/O pins to support extensive interfacing and system-level connectivity.
  • Package 1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
  • Power Core supply voltage specified from 870 mV to 930 mV to match system power-rail requirements.
  • Operating Conditions & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant for environmental requirements.

Unique Advantages

  • High logic integration: 175,750 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
  • Significant embedded memory: Approximately 14 Mbits of on-chip RAM supports data buffering and fast local storage without external memory in many use cases.
  • Extensive I/O capability: 564 I/O pins provide flexibility for complex interfaces and multiple high-pin-count peripherals.
  • Compact surface-mount package: 1152-FBGA (35×35) package enables high-density PCB layouts while maintaining robust electrical connections.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation to match general-purpose electronics and commercial deployments.
  • RoHS compliant: Meets regulatory requirements for restricted substances in electronic assemblies.

Why Choose EP4SGX180FF35C3N?

The EP4SGX180FF35C3N offers a balanced combination of high logic element count, substantial embedded memory, and a large number of I/Os in a compact surface-mount FBGA package. Its electrical and thermal specifications—core voltage range of 870 mV to 930 mV and a 0 °C to 85 °C operating range—make it suitable for commercial designs that require dense on-chip resources and flexible interfacing.

This device is well suited to engineers and teams seeking to consolidate functionality onto a single FPGA to simplify board design, reduce bill of materials, and support complex programmable logic requirements within commercial-temperature applications.

Request a quote or submit an inquiry for pricing and availability for EP4SGX180FF35C3N to receive a customized response for your project requirements.

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