EP4SGX180FF35C2XN

The EP4SGX180FF35C2XN is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152-BBGA (35×35) FCBGA package for surface-mount assembly. It combines high logic density and significant on-chip memory with a large I/O count to support complex digital designs within a commercial temperature range.

This device is aimed at designs that require substantial programmable logic resources, ample embedded RAM, and high pin counts while operating on a low core supply voltage and maintaining RoHS compliance.

Key Features

• Logic Capacity  175,750 logic elements to implement large-scale digital logic, state machines and custom processing blocks.
• Embedded Memory  Approximately 14 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Density  564 I/O pins to support wide parallel interfaces, multiple peripherals, and extensive routing to external devices.
• Packaging  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) optimized for high-pin-count, high-density board layouts and surface-mount assembly.
• Power  Core voltage supply range of 870 mV to 930 mV for low-voltage core operation.
• Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmentally conscious system design and manufacturing.

Typical Applications

• High-density digital processing  Large programmable logic capacity supports complex custom datapaths, protocol processing and parallel computation tasks.
• Buffered data handling  Embedded RAM enables on-chip buffering and FIFO implementations for data flow management between system blocks.
• Multi-interface gateway  High I/O count accommodates multiple external buses, parallel sensors, and peripheral interfaces in a single device.

Unique Advantages

• Substantial programmable logic: 175,750 logic elements allow consolidation of multiple functions into one FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 14 Mbits of embedded RAM supports large local storage needs without external memory.
• High I/O capacity: 564 I/O pins enable broad connectivity and flexible system interfacing options.
• Compact, high-density package: 1152-BBGA (35×35) package provides a high pin-count solution in a compact footprint for dense PCB designs.
• Low-voltage core operation: 870 mV–930 mV supply range supports low-power core operation when integrated into power-conscious designs.
• Commercial-grade and RoHS compliant: Designed for commercial temperature environments with RoHS compliance for regulated manufacturing requirements.

Why Choose EP4SGX180FF35C2XN?

The EP4SGX180FF35C2XN positions itself as a high-capacity Stratix® IV GX FPGA option for engineers needing extensive logic resources, substantial embedded RAM, and a large number of I/Os in a compact FCBGA package. Its low core voltage and commercial operating range make it suitable for mainstream embedded and digital designs that require dense integration.

This device fits projects that benefit from consolidating functions into a single FPGA—reducing BOM complexity and board area—while meeting RoHS requirements and commercial temperature constraints.

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