EP4SGX180DF29I4N

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA

Quantity 149 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180DF29I4N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC

The EP4SGX180DF29I4N is a Stratix® IV GX FPGA configured in a 780-FBGA (29×29) package and manufactured by Intel. It combines a high logic capacity fabric, on-chip embedded memory, and extensive I/O to address high-bandwidth digital processing and system-integration requirements.

Designed for industrial-grade applications, the device family documentation highlights features such as high-speed transceiver capabilities, wide protocol support, and architecture elements tailored for demanding communications, video, and signal-processing markets.

Key Features

  • Logic Capacity — Approximately 175,750 logic elements and 7,030 CLBs provide significant programmable fabric for complex designs.
  • Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support large buffering and local storage requirements.
  • I/O Density — 372 I/Os for flexible system interfacing and high-pin-count connectivity.
  • High-Speed Transceiver & Protocol Support — Stratix IV GX device family features include high-speed transceiver capabilities and a wide range of protocol support as described in the device handbook.
  • Power Supply — Core operating voltage specified between 870 mV and 930 mV, enabling predictable power planning for the FPGA core.
  • Package — 780-FBGA (29×29) FCBGA package for dense board-level integration.
  • Operating Temperature — Industrial operating range from –40 °C to 100 °C for robust performance in demanding environments.
  • Documentation — Supported by the Stratix IV Device Handbook and related technical documentation for architecture and integration guidance.

Typical Applications

  • Telecommunications & Networking — Use for high-bandwidth packet processing, protocol bridging, and interface aggregation where extensive I/O and transceiver capability are required.
  • High-Performance Signal Processing — Suitable for DSP-centric pipelines and real-time data path implementations that benefit from large logic capacity and embedded memory.
  • Video and Imaging Systems — Implement video-processing pipelines, frame buffering, and custom video interfaces leveraging on-chip RAM and abundant I/O.
  • Industrial Infrastructure — Control, data acquisition, and protocol conversion in industrial systems using the device’s industrial temperature rating and flexible I/O.

Unique Advantages

  • High Logic Density: Approximately 175,750 logic elements enable implementation of large, complex digital systems without external glue logic.
  • Substantial Embedded Memory: About 13.95 Mbits of on-chip RAM reduces dependency on external memory for buffering and local storage.
  • Extensive I/O Count: 372 I/Os provide the connectivity needed for multi-channel interfaces and high-pin-count systems.
  • Industrial Temperature Rating: Rated from –40 °C to 100 °C to meet reliability requirements for industrial deployments.
  • Clear Power Envelope: Core voltage specified at 870–930 mV allows predictable power budgeting and thermal planning.
  • Well-Documented Device Family: Stratix IV GX architecture and feature set are supported by the device handbook and accompanying documentation for design and integration.

Why Choose EP4SGX180DF29I4N?

The EP4SGX180DF29I4N positions itself as a high-density, industrial-grade FPGA option within the Stratix IV GX family, combining significant logic and memory resources with extensive I/O and family-level high-speed transceiver features. Its specified core voltage and wide operating temperature range make it suitable for robust, long-lived installations where integration density and deterministic power characteristics matter.

Engineers building communications, high-performance signal-processing, or industrial control systems will find the device’s capacity, documented architecture, and package integration advantageous for reducing board-level complexity and accelerating system development.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4SGX180DF29I4N. Our team can provide component lead-time details and support for your BOM and design planning.

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