EP4SGX180DF29I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 538 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180DF29I3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX180DF29I3G is a Stratix IV family Field Programmable Gate Array (FPGA) IC designed for high‑density, high‑performance digital logic integration. It combines a large logic fabric with on‑chip embedded memory and a broad set of I/O resources to address demanding processing and data‑movement tasks.
Targeted at industrial applications, communications, and data‑intensive systems, this device delivers substantial logic capacity, approximately 14 Mbits of embedded RAM, and advanced architecture features documented in the Stratix IV device handbook such as high‑speed transceiver capabilities, DSP blocks, PLLs and flexible clock networks.
Key Features
- Logic Capacity — The device provides approximately 175,750 logic elements supported by 7,030 logic blocks for complex digital designs and large‑scale integration.
- Embedded Memory — Approximately 14 Mbits of total on‑chip RAM to support buffering, packet processing, and intermediate storage without external memory for many functions.
- I/O Resources — 372 general‑purpose I/O pins to interface with peripherals, memory devices, and high‑speed lanes.
- Stratix IV Architecture Features — Architecture and handbook references indicate integrated DSP blocks, PLLs, advanced clock networks and high‑speed transceiver features for protocol and bandwidth‑oriented designs.
- Package & Mounting — 780‑ball FCBGA (29×29) surface‑mount package (780‑FBGA) suitable for dense board layouts and thermal management considerations.
- Power Supply Range — Core supply specified from 870 mV to 930 mV, enabling designs that follow the device’s documented power requirements.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Regulatory Compliance — RoHS compliant for lead‑free manufacturing processes.
Typical Applications
- Telecommunications & Networking — Use the device’s high logic density and documented high‑speed transceiver features for packet processing, protocol bridging, and switching fabrics.
- Data Acquisition & Processing — Leverage the large embedded memory and DSP resources for real‑time signal processing and buffering in measurement and test systems.
- Industrial Control — The industrial temperature grade and extensive I/O make it suitable for motor control, programmable logic controllers, and factory automation interfaces.
- Video and Broadcast Systems — High logic capacity and on‑chip RAM support video pipelines, format conversion, and stream buffering tasks.
Unique Advantages
- High Logic Density: Approximately 175,750 logic elements enable consolidation of complex functions into a single device, reducing board count and system complexity.
- Substantial On‑Chip Memory: Approximately 14 Mbits of embedded RAM allows local buffering and memory‑centric algorithms without immediate dependence on external DRAM.
- Large I/O Complement: 372 I/O pins provide flexible interfacing options for sensors, transceivers, memory, and control signals.
- Industrial‑Grade Operation: Rated from −40 °C to 100 °C for reliable operation in harsh industrial environments.
- Documented Architecture: Backed by the Stratix IV device handbook, which details core architecture, transceiver features, DSP blocks and clocking resources for system design planning.
- RoHS Compliant: Facilitates use in lead‑free manufacturing flows and modern supply chains.
Why Choose EP4SGX180DF29I3G?
The EP4SGX180DF29I3G positions itself as a high‑capacity FPGA solution for engineers who need substantial logic, embedded memory and extensive I/O within an industrial temperature envelope. Its Stratix IV architecture elements documented in the device handbook—such as transceiver capabilities, DSP resources and advanced clocking—help address bandwidth‑intensive and compute‑heavy applications.
Choose this device when your design requires scalable logic and memory resources, a dense BGA package for compact boards, and operation across a wide industrial temperature range. The combination of on‑chip RAM, logic capacity and documented architecture supports long‑lifecycle, high‑performance projects where integration and deterministic device behavior matter.
Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX180DF29I3G. Our team can provide lead‑time details and help with part procurement and volume pricing.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018