EP4SGX180DF29I3N

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA

Quantity 625 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180DF29I3N – Stratix IV GX FPGA, 175,750 logic elements, 780-FBGA (29×29), Industrial

The EP4SGX180DF29I3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) in a 780-FBGA (29×29) surface-mount package. It delivers large programmable logic capacity and significant embedded memory in an industrial-grade device.

With 175,750 logic elements, approximately 13.95 Mbits of on-chip RAM and 372 I/Os, this device targets industrial designs that require dense logic, substantial embedded memory, and extensive I/O. The Stratix IV Device Handbook for the series documents integrated transceiver, PLL, DSP block and TriMatrix memory resources that support complex system implementations.

Key Features

  • Core Logic — 175,750 logic elements provide a large fabric for implementing complex programmable logic and custom hardware functions.
  • Embedded Memory — Approximately 13.95 Mbits of on-chip RAM for buffering, state storage, and memory-intensive algorithms.
  • I/O Capacity — 372 user I/Os to support multiple interfaces, parallel buses and mixed-signal front ends.
  • On-chip Peripherals — The Stratix IV device documentation includes Transceiver Performance Specifications, PLL specifications, DSP block specifications and TriMatrix memory block specifications, indicating integrated high-speed and signal-processing resources.
  • Package & Mounting — 780-BBGA, FCBGA package (supplier device package: 780-FBGA 29×29) in a surface-mount form factor for compact PCB implementations.
  • Power — Core voltage supply specified from 870 mV to 930 mV for predictable power planning.
  • Operating Range — Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • High‑speed communications — Use integrated transceivers and abundant logic/memory to implement serial links, protocol processing, and aggregation functions.
  • Signal processing and DSP — Leverage on‑chip DSP blocks and TriMatrix memory for filtering, transforms, and real‑time data processing.
  • Industrial control and automation — Industrial temperature rating and extensive I/O make the device suitable for motor control, programmable logic controllers, and factory automation interfaces.
  • Custom hardware acceleration — Large logic capacity and embedded memory support custom accelerators for compute‑intensive tasks and proprietary algorithms.

Unique Advantages

  • High logic density: 175,750 logic elements let you implement large-scale, integrated designs and reduce partitioning across multiple devices.
  • Significant embedded memory: Approximately 13.95 Mbits of on-chip RAM lowers dependence on external memory and improves data throughput for buffering and stateful logic.
  • Extensive I/O connectivity: 372 I/Os provide flexibility to interface with sensors, peripherals and parallel or serial subsystems without extensive board-level multiplexing.
  • Integrated high‑speed and DSP resources: Documented transceiver, PLL and DSP block specifications enable system designs that require clock management, serial data lanes and real‑time signal processing.
  • Industrial reliability: Rated for −40 °C to 100 °C operation to meet harsh-environment deployment requirements.
  • Compact FCBGA package: 780‑FBGA (29×29) surface‑mount footprint balances high I/O and integration with board-level space constraints.

Why Choose EP4SGX180DF29I3N?

The EP4SGX180DF29I3N positions itself as a high-capacity, industrial-grade Stratix IV GX FPGA suited to designs that demand large programmable logic resources, embedded memory, and significant I/O. Its documented on-chip transceivers, PLLs, DSP blocks and TriMatrix memory make it appropriate for communications, signal-processing and industrial control applications where integration and reliability matter.

For engineering teams and procurement sourcing capable FPGAs for long‑life industrial systems, this device offers a combination of logic density, memory, I/O count and package options that supports scalable, robust implementations backed by the Stratix IV device documentation.

Request a quote or submit an inquiry to check availability and pricing for the EP4SGX180DF29I3N. Provide your quantity and delivery requirements to receive a tailored response.

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