EP4SGX180DF29I3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA |
|---|---|
| Quantity | 625 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180DF29I3N – Stratix IV GX FPGA, 175,750 logic elements, 780-FBGA (29×29), Industrial
The EP4SGX180DF29I3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) in a 780-FBGA (29×29) surface-mount package. It delivers large programmable logic capacity and significant embedded memory in an industrial-grade device.
With 175,750 logic elements, approximately 13.95 Mbits of on-chip RAM and 372 I/Os, this device targets industrial designs that require dense logic, substantial embedded memory, and extensive I/O. The Stratix IV Device Handbook for the series documents integrated transceiver, PLL, DSP block and TriMatrix memory resources that support complex system implementations.
Key Features
- Core Logic — 175,750 logic elements provide a large fabric for implementing complex programmable logic and custom hardware functions.
- Embedded Memory — Approximately 13.95 Mbits of on-chip RAM for buffering, state storage, and memory-intensive algorithms.
- I/O Capacity — 372 user I/Os to support multiple interfaces, parallel buses and mixed-signal front ends.
- On-chip Peripherals — The Stratix IV device documentation includes Transceiver Performance Specifications, PLL specifications, DSP block specifications and TriMatrix memory block specifications, indicating integrated high-speed and signal-processing resources.
- Package & Mounting — 780-BBGA, FCBGA package (supplier device package: 780-FBGA 29×29) in a surface-mount form factor for compact PCB implementations.
- Power — Core voltage supply specified from 870 mV to 930 mV for predictable power planning.
- Operating Range — Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Regulatory — RoHS compliant.
Typical Applications
- High‑speed communications — Use integrated transceivers and abundant logic/memory to implement serial links, protocol processing, and aggregation functions.
- Signal processing and DSP — Leverage on‑chip DSP blocks and TriMatrix memory for filtering, transforms, and real‑time data processing.
- Industrial control and automation — Industrial temperature rating and extensive I/O make the device suitable for motor control, programmable logic controllers, and factory automation interfaces.
- Custom hardware acceleration — Large logic capacity and embedded memory support custom accelerators for compute‑intensive tasks and proprietary algorithms.
Unique Advantages
- High logic density: 175,750 logic elements let you implement large-scale, integrated designs and reduce partitioning across multiple devices.
- Significant embedded memory: Approximately 13.95 Mbits of on-chip RAM lowers dependence on external memory and improves data throughput for buffering and stateful logic.
- Extensive I/O connectivity: 372 I/Os provide flexibility to interface with sensors, peripherals and parallel or serial subsystems without extensive board-level multiplexing.
- Integrated high‑speed and DSP resources: Documented transceiver, PLL and DSP block specifications enable system designs that require clock management, serial data lanes and real‑time signal processing.
- Industrial reliability: Rated for −40 °C to 100 °C operation to meet harsh-environment deployment requirements.
- Compact FCBGA package: 780‑FBGA (29×29) surface‑mount footprint balances high I/O and integration with board-level space constraints.
Why Choose EP4SGX180DF29I3N?
The EP4SGX180DF29I3N positions itself as a high-capacity, industrial-grade Stratix IV GX FPGA suited to designs that demand large programmable logic resources, embedded memory, and significant I/O. Its documented on-chip transceivers, PLLs, DSP blocks and TriMatrix memory make it appropriate for communications, signal-processing and industrial control applications where integration and reliability matter.
For engineering teams and procurement sourcing capable FPGAs for long‑life industrial systems, this device offers a combination of logic density, memory, I/O count and package options that supports scalable, robust implementations backed by the Stratix IV device documentation.
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