EP4SGX180DF29I3

The EP4SGX180DF29I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) supplied in a 780‑FBGA (29×29) surface‑mount package for industrial applications. It delivers high logic density and on‑chip memory capacity for designs that require significant programmable logic, abundant I/O, and operation across an extended temperature range.

Key device characteristics include 175,750 logic elements, approximately 13.95 Mbits of embedded memory, 372 user I/O pins, low-voltage core supply range, and an industrial operating temperature rating—attributes that support compact, high‑integration system designs.

Key Features

• Core Logic  175,750 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 13.95 Mbits of on‑chip RAM to support buffering, state storage, and data‑path implementations without external memory.
• I/O Capacity  372 user I/O pins enable broad external device interfacing and parallel signal routing in compact layouts.
• Power and Voltage  Core voltage supply specified between 870 mV and 930 mV to match low‑voltage system architectures and power domains.
• Package & Mounting  780‑FBGA (29×29) package in a surface‑mount form factor (listed as 780‑BBGA, FCBGA) for space‑efficient board-level integration.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C, suitable for applications with extended ambient temperature requirements.
• Regulatory Compliance  RoHS compliant, supporting environmentally conscious manufacturing and assembly processes.

Unique Advantages

• High logic density: 175,750 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• On-chip memory availability: Approximately 13.95 Mbits of embedded RAM decreases reliance on external memory and shortens critical data paths.
• Extensive I/O: 372 I/O pins enable flexible interfacing with peripherals, sensors, and high‑pin-count connectors without additional expansion chips.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployments in harsh or temperature‑variable environments.
• Compact surface‑mount package: 780‑FBGA (29×29) package supports dense PCB layouts and automated assembly methods.
• Low‑voltage core support: Narrow supply range (870 mV–930 mV) for integration into low‑power system domains.

Why Choose EP4SGX180DF29I3?

The EP4SGX180DF29I3 positions itself as a high‑integration FPGA option for developers needing large programmable logic capacity, substantial on‑chip RAM, and a high count of I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle designs where environmental tolerance and regulatory compliance matter.

This device is well suited to engineers and teams consolidating complex digital functions into a single FPGA, optimizing board space, and targeting robust operation across a wide temperature range while maintaining low‑voltage core operation.

If you would like pricing, availability, or to request a formal quotation for EP4SGX180DF29I3, please submit a quote request or sales inquiry referencing the full part number.