EP4SGX180DF29C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 13954048 175750 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,573 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180DF29C4 – Stratix® IV GX Field Programmable Gate Array (FPGA) IC
The EP4SGX180DF29C4 is an Intel Stratix IV GX Field Programmable Gate Array offered in a 780-BBGA FCBGA (29×29) package. It delivers a high-density programmable fabric with 175,750 logic elements and embedded memory suited for complex digital designs.
Documented in the Stratix IV Device Handbook, the device includes detailed specifications for DC and switching characteristics, I/O standards, power, PLLs, DSP and TriMatrix memory blocks, transceiver performance, configuration and JTAG, and other periphery functions—making it appropriate for designs that require substantial logic, memory, and I/O resources within a commercial-grade temperature range.
Key Features
- High Logic Capacity The device provides 175,750 logic elements to support large-scale combinational and sequential logic implementations.
- Embedded Memory Approximately 13.95 Mbits of on‑chip RAM (13,954,048 total RAM bits) for buffering, lookup tables, and intermediate data storage.
- I/O Density 372 user I/O pins available for broad external connectivity and system interfacing.
- Package and Mounting 780‑BBGA FCBGA (supplier package 780‑FBGA, 29×29) in a surface-mount form factor to support compact board-level integration.
- Power and Operating Range Core voltage supply specified from 870 mV to 930 mV; operating temperature range 0 °C to 85 °C (commercial grade).
- Design and Performance Documentation Datasheet and device handbook content includes DC/switching characteristics, power consumption, PLL and clock tree specs, DSP block and TriMatrix memory block specifications, and transceiver performance details for engineering evaluation.
- Compliance RoHS compliant to support environmental regulations in commercial electronics.
Typical Applications
- High-performance signal processing Leverage the DSP block and substantial logic resources to implement filtering, encoding/decoding, and real‑time compute tasks.
- Memory‑intensive accelerators Use the approximately 13.95 Mbits of embedded RAM for packet buffering, frame buffering, or on‑chip data staging.
- I/O‑centric systems The 372 I/O pins support complex interface multiplexing, sensor aggregation, and board-level control functions.
- Prototyping and system integration The comprehensive device handbook material (configuration, JTAG, clocking, and power characteristics) supports integration into complex prototype or production designs.
Unique Advantages
- High logic density: 175,750 logic elements enable implementation of large RTL blocks and custom accelerators without immediate need for multi‑chip partitioning.
- Significant on‑chip memory: Approximately 13.95 Mbits of embedded RAM reduces external memory dependency for many buffering and storage tasks.
- Extensive I/O flexibility: 372 I/O pins provide the routing capacity for multi‑bus systems and diverse peripheral interfaces.
- Comprehensive technical documentation: The Stratix IV Device Handbook provides DC/switching, PLL, DSP, TriMatrix memory, and transceiver specifications to aid design verification and optimization.
- Compact surface-mount package: 780‑BBGA (29×29) packaging enables dense board layouts while maintaining thermal and electrical characteristics defined in the datasheet.
- Commercial-grade robustness: Rated for operation from 0 °C to 85 °C and RoHS compliant for standard commercial electronics deployments.
Why Choose EP4SGX180DF29C4?
EP4SGX180DF29C4 positions itself as a high-capacity Stratix IV GX FPGA suitable for complex, memory- and logic‑intensive designs that require documented electrical, timing, and periphery performance. Its combination of 175,750 logic elements, substantial embedded RAM, and a high I/O count supports integration of compute, buffering, and interface functions within a single device.
The device is supported by detailed datasheet and handbook material covering key design areas—power, clocking, PLLs, DSP and memory blocks, transceiver performance, and configuration—helping engineering teams evaluate and integrate the FPGA into commercial applications requiring proven documentation and predictable operating ranges.
Request a quote or submit an inquiry to obtain pricing, lead time, and availability for EP4SGX180DF29C4. Our team can provide additional technical documentation and procurement assistance upon request.

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