EP4SGX180DF29C3G

The EP4SGX180DF29C3G is an Intel Stratix IV–family Field Programmable Gate Array delivered in a 780‑ball FBGA surface-mount package. It provides a high-density FPGA fabric together with embedded memory and a large I/O complement for complex digital designs.

Typical use cases include high-throughput data processing, protocol and interface bridging, and advanced system integration where a combination of logic capacity, on-chip memory, and extensive I/O are required. The device operates from a core supply range of 870 mV to 930 mV and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• High-density logic — Approximately 175,750 logic elements to implement complex gateware and custom processing pipelines.
• Embedded memory — Approximately 13.95 Mbits of on-chip RAM (13,954,048 bits) for buffering, packet storage, and scratch memory.
• I/O capacity — 372 user I/Os to support wide external connectivity and multi-channel interfaces.
• Stratix IV architecture — Device family features such as programmable PLLs, clock networks, DSP resources, and high-speed I/O capabilities are described in the Stratix IV Device Handbook.
• Power and temperature — Core voltage supply range of 870 mV to 930 mV and commercial operating range from 0 °C to 85 °C, suitable for standard commercial applications.
• Package and mounting — 780‑FBGA package in a 29×29 mm ball-array format with surface-mount mounting for compact board integration.
• Standards compliance — RoHS compliant.

Typical Applications

• High‑performance signal processing — Use the large logic element count and embedded memory for DSP pipelines and real‑time data manipulation.
• Interface bridging and protocol conversion — Leverage extensive I/O resources to aggregate and translate between multiple serial and parallel interfaces.
• External memory controllers — Combine the device’s fabric and memory resources to implement custom memory interface logic and buffering.
• System integration and prototyping — Implement complex system functions, clocking schemes, and custom peripherals within a single FPGA package for rapid development.

Unique Advantages

• Large logic capacity: Approximately 175,750 logic elements enable dense implementations of complex algorithms and custom accelerators.
• Substantial on‑chip memory: Approximately 13.95 Mbits of embedded RAM reduces dependence on external memory for intermediate storage and buffering.
• Extensive I/O: 372 user I/Os support multi-channel connectivity and flexible board-level interfacing options.
• Stratix IV family documentation: Architecture-level features such as PLLs, clock networks, DSP blocks, and high-speed I/O are documented in the Stratix IV Device Handbook for design reference.
• Compact surface‑mount FBGA package: 780‑FBGA (29×29) packaging supports dense PCB layouts while providing robust electrical connections.
• Regulatory-friendly: RoHS compliance simplifies integration into products targeting RoHS-conformant regions.

Why Choose EP4SGX180DF29C3G?

The EP4SGX180DF29C3G positions itself as a high-density Stratix IV FPGA option for engineers who need substantial logic, embedded memory, and broad I/O in a compact FBGA package. Its combination of approximately 175,750 logic elements, roughly 13.95 Mbits of on-chip RAM, and 372 I/Os supports demanding data-paths and system-level functions.

Backed by the Stratix IV Device Handbook documentation, this device is suitable for commercial designs that require a proven FPGA architecture, configurable clocking and DSP resources, and documented high-speed I/O features. It is a practical choice for teams building complex, scalable digital systems that rely on vendor documentation and family-level feature sets.

Request a quote or submit an inquiry to receive pricing and availability for EP4SGX180DF29C3G and to discuss how this FPGA can meet your design requirements.