EP4SGX180DF29C3

The EP4SGX180DF29C3 is a Stratix® IV GX field programmable gate array (FPGA) from Intel delivering high logic and memory capacity in a 780-BBGA FCBGA package. It provides 175,750 logic elements and approximately 13.95 Mbits of embedded memory (13,954,048 total RAM bits), making it suitable for dense digital implementations.

As a commercial-grade device, the EP4SGX180DF29C3 offers 372 I/O, a supply voltage range of 870 mV to 930 mV, and an operating temperature range of 0°C to 85°C. The device is RoHS compliant and is supplied in a 780-FBGA (29×29) surface-mount package.

Key Features

• Core / Architecture  Stratix® IV GX FPGA architecture from Intel, providing a fabric designed for high-density logic implementations.
• Logic Capacity  175,750 logic elements to support complex digital designs and large-scale logic integration.
• Embedded Memory  Approximately 13.95 Mbits of on-chip RAM (13,954,048 total RAM bits) to support data buffering, frame storage, and intermediate processing without immediate reliance on external memory.
• I/O Count  372 I/O pins to enable broad external connectivity and interface options.
• Package & Mounting  780-BBGA, FCBGA package; supplier device package 780-FBGA (29×29); surface-mount mounting for compact board-level integration.
• Power  Voltage supply range: 870 mV to 930 mV, enabling defined system power planning.
• Temperature & Grade  Commercial grade device with operating temperature range of 0°C to 85°C.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• High-density digital systems  Implement complex control logic and large state machines using the device’s 175,750 logic elements and substantial on-chip RAM.
• Signal processing pipelines  Use the embedded memory and logic resources for buffering, filtering, and streaming data operations in DSP tasks.
• Custom hardware acceleration  Build bespoke accelerators and hardware engines within the FPGA fabric to offload compute-intensive tasks from processors.
• Interface aggregation and protocol bridging  Leverage 372 I/O to consolidate multiple external interfaces and implement protocol translation or aggregation logic.

Unique Advantages

• High logic density: 175,750 logic elements reduce the need for multi-device architectures, simplifying board design and system partitioning.
• Substantial on-chip memory: Approximately 13.95 Mbits of embedded RAM helps minimize external memory dependency for many buffering and storage needs.
• Extensive I/O capability: 372 I/O pins provide flexibility for complex interconnect and peripheral integration.
• Compact, high-pin-count package: 780-BBGA (29×29) FCBGA offers a space-efficient form factor for high-density applications.
• Commercial-grade readiness: 0°C to 85°C operating range suits a wide range of commercial deployments where controlled environmental conditions apply.
• Regulatory compliance: RoHS compliance supports lead-free assembly requirements.

Why Choose EP4SGX180DF29C3?

The EP4SGX180DF29C3 delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in a compact 780-BBGA package, positioning it for demanding commercial designs that require dense FPGA resources. Its defined supply voltage range and commercial operating temperature make it suitable for board-level integration where those electrical and environmental parameters are met.

Engineers and procurement teams targeting designs with substantial on-chip logic and RAM needs will find this Stratix® IV GX device a viable option for consolidating functionality, reducing external component count, and meeting form-factor constraints. Its specifications provide a clear basis for system planning and integration within Intel’s Stratix IV GX family context.

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