EP4SGX110HF35I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 256 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110HF35I4N – Stratix® IV GX FPGA, 1152-BBGA
The EP4SGX110HF35I4N is a Stratix® IV GX field-programmable gate array (FPGA) supplied in a 1152-ball FCBGA package (35 × 35). It delivers a high logic capacity and on-chip memory tailored for demanding digital designs that require large I/O counts and system integration within an industrial temperature range.
Designed for applications that need substantial embedded logic, many I/O and on-chip RAM, this device balances dense programmable logic with peripheral and system-level features documented in the Stratix IV device handbook.
Key Features
- Logic Capacity — Approximately 105,600 logic elements providing extensive resources for complex digital implementations and programmable fabric.
- Embedded Memory — Approximately 9.79 Mbits of on-chip RAM suitable for buffering, frame storage, and memory-intensive processing blocks.
- I/O Density — 488 user I/O pins to support multiple interfaces, parallel buses and high pin-count system connections.
- Package and Mounting — 1152-ball FBGA (35 × 35) surface-mount package for compact board-level integration in space-constrained designs.
- Voltage Supply — Core supply range 0.870 V to 0.930 V, suitable for designs targeting the device’s specified power domain.
- Operating Range — Industrial temperature grading with an operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
- On-chip System Blocks — Device handbook coverage includes PLLs, transceiver datapath and performance specifications, DSP block specifications and TriMatrix memory block specifications, enabling advanced timing, I/O and signal-processing architectures.
- Compliance — RoHS-compliant component suitable for environmentally conscious manufacturing processes.
Typical Applications
- Communications & Networking — High I/O count and device handbook transceiver specifications make this device suitable for protocol bridging, packet processing and interface aggregation tasks.
- Signal Processing & DSP — Significant logic element count and documented DSP block specifications support custom filtering, transforms and real-time data processing pipelines.
- Industrial Control & Instrumentation — Industrial temperature range and dense I/O enable integration into industrial automation, control systems and measurement equipment.
- Video & Imaging Systems — Substantial embedded memory and logic resources accommodate frame buffering, pixel processing and video pipeline implementation.
Unique Advantages
- High logic integration: With approximately 105,600 logic elements, the device supports complex finite-state machines, custom accelerators and large-scale glue logic without external ASICs.
- Large on-chip RAM: Approximately 9.79 Mbits of embedded memory reduces dependence on external memory for buffering and data staging, simplifying board design.
- Extensive I/O capability: 488 I/O pins provide flexibility for multi-channel interfaces, parallel data buses and mixed-signal front ends.
- Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging deployments.
- Compact surface-mount package: 1152-ball FBGA (35 × 35) enables high-density PCB layouts while maintaining robust connectivity for high-pin-count designs.
- Documented system features: The Stratix IV device handbook details PLLs, transceiver and DSP block capabilities that support system-level design and timing architectures.
Why Choose EP4SGX110HF35I4N?
The EP4SGX110HF35I4N positions itself as a high-capacity Stratix IV GX FPGA option for engineers who need substantial programmable logic, significant embedded memory and broad I/O in an industrial-temperature device. Its combination of logic elements, on-chip RAM and documented system building blocks enables integration of compute, interface and signal-processing functions on a single device.
This device is well suited for teams and projects that require scalability within the Stratix IV family, deterministic operating conditions across −40 °C to 100 °C, and a compact FBGA package to optimize board real estate while maintaining high pin count and system flexibility.
Request a quote or submit a product inquiry to receive pricing, lead-time and availability information for EP4SGX110HF35I4N. Our team can provide assistance with part procurement and volume options.

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