EP4SGX110HF35I4G

The EP4SGX110HF35I4G is a Stratix IV GX family FPGA supplied in a 1152-BBGA (35×35) surface-mount package and graded for industrial operation. It integrates a large FPGA fabric with extensive embedded memory and a high I/O count to support complex, high-density designs.

This device is suited for systems that require a combination of abundant logic resources, on-chip RAM, and series-level features such as high-speed transceivers, DSP blocks, and flexible I/O and clocking resources as documented in the Stratix IV device handbook.

Key Features

• Core logic capacity — 105,600 logic elements provide capacity for large, resource-intensive designs and complex custom logic implementations.
• Embedded memory — Approximately 9.79 Mbits of on-chip RAM to support buffering, FIFO structures, and memory-intensive algorithms without immediate external RAM dependence.
• I/O and package — 488 I/O pins in a 1152-BBGA (FCBGA) package (supplier package: 1152-FBGA, 35×35) for dense board-level interfacing and high pin-count requirements; surface-mount mounting.
• Series-level transceivers and DSP — Stratix IV GX devices include high-speed transceiver features and DSP blocks as described in the device handbook, enabling high-bandwidth links and signal-processing functions.
• Clocking and timing — Integrated PLLs and clock network features in the Stratix IV family provide deterministic clock distribution and support for complex timing architectures.
• Power supply — Core voltage supply range of 870 mV to 930 mV (0.87 V–0.93 V), consistent with the Stratix IV GX core requirements.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Compliance — RoHS compliant.

Typical Applications

• Networking & Communications — Use the device’s series-level high-speed transceiver features and large logic fabric to implement protocol processing, packet handling, and high-throughput data paths.
• Digital Signal Processing — Leverage the on-chip DSP blocks and approximately 9.79 Mbits of embedded memory for filtering, FFTs, and real-time signal pipelines.
• External memory interfaces and bridging — The Stratix IV family’s external memory interface features support designs that require controlled memory access, buffering, and interface bridging.
• High-density I/O systems — With 488 I/Os and a 1152-BBGA package, the device is appropriate for applications requiring many parallel interfaces or multi-channel data acquisition and control.

Unique Advantages

• Large programmable capacity: 105,600 logic elements enable complex state machines, custom accelerators, and large datapath implementations without immediate partitioning.
• Substantial embedded memory: Approximately 9.79 Mbits of on-chip RAM reduces external memory dependency for many buffering and local-storage needs.
• High I/O density: 488 I/Os in a 1152-FBGA footprint provide flexibility for rich peripheral connectivity and board-level routing options.
• Industrial-temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments with wider temperature swings.
• Series features for bandwidth and signal processing: The Stratix IV GX family includes high-speed transceivers, DSP blocks, PLLs, and robust clocking resources to address bandwidth- and latency-sensitive designs.
• Low-voltage core operation: Core supply between 0.87 V and 0.93 V aligns with modern FPGA power architectures and system power domains.

Why Choose EP4SGX110HF35I4G?

The EP4SGX110HF35I4G combines a large logic element count, significant on-chip RAM, and a high I/O complement in a surface-mount 1152-BBGA package, making it suitable for demanding industrial and communications designs that need integrated DSP and transceiver capabilities. Its industrial temperature rating and RoHS compliance further support long-term deployment in production systems.

This part is appropriate for engineering teams building high-density, high-bandwidth systems that require the Stratix IV GX family’s device-level features—such as integrated transceivers, DSP resources, and flexible clocking—while maintaining board-level density and industrial operating range.

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