EP4SGX110HF35I3

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 1,207 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35I3 – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX110HF35I3 is a Stratix® IV GX FPGA in a 1152-BBGA (FCBGA) package. It provides a high logic capacity programmable fabric with substantial on-chip memory and a large I/O complement for complex, integration-heavy designs.

Key hardware characteristics include 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 488 I/O pins, combined with industrial-grade temperature and power specifications aimed at robust system deployments.

Key Features

  • Programmable Logic Capacity  105,600 logic elements to implement complex digital functions and custom logic architectures.
  • Embedded Memory  Approximately 9.79 Mbits of on‑chip RAM for data buffering, FIFOs, and local storage close to logic.
  • I/O Density  488 I/O pins to support wide bus interfaces and multiple peripheral connections without extensive external logic.
  • Package and Mounting  1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), designed for surface‑mount assembly.
  • Power Supply  Operational core voltage range of 870 mV to 930 mV for core power planning and regulator selection.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation for use in thermally demanding environments.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Unique Advantages

  • High logic density: 105,600 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level complexity.
  • Substantial on-chip RAM: Approximately 9.79 Mbits of embedded memory enables local buffering and high-throughput data handling without relying on external memory.
  • Extensive I/O count: 488 I/Os allow support for broad parallel interfaces and multiple peripherals directly at the FPGA.
  • Industrial-grade thermal range: Specified −40 °C to 100 °C operation supports deployments in harsh or variable temperature environments.
  • Space-efficient package: 1152‑BBGA (35×35) FCBGA package provides a compact surface-mount solution for high-density designs.
  • Deterministic power requirements: Defined core voltage range (870 mV–930 mV) simplifies power-supply design and qualification.

Why Choose EP4SGX110HF35I3?

The EP4SGX110HF35I3 positions itself as a high-capacity, industrial-grade FPGA option for engineers who need large programmable logic resources combined with significant embedded memory and a high I/O count. Its package and surface-mount design support dense PCB integration while the specified operating temperature and RoHS compliance align with many industrial deployment requirements.

This device is suitable for development teams and procurement looking for a scalable FPGA building block that consolidates functions on-chip, simplifies board-level design, and provides documented hardware parameters for power and thermal planning.

Request a quote or submit a purchasing inquiry to receive pricing, availability, and lead-time information for the EP4SGX110HF35I3.

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