EP4SGX180DF29C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,373 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180DF29C4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX180DF29C4G is a Field Programmable Gate Array (FPGA) IC from the Stratix IV device family, built around the GX device architecture described in the device handbook. It combines high logic density, embedded memory, and dedicated I/O resources for advanced protocol support and high-throughput designs.
Designed for commercial-grade applications, this device addresses use cases requiring extensive programmable logic, substantial on-chip memory, and flexible I/O — including high-speed serial communications, external memory interfaces, and DSP-accelerated processing.
Key Features
- Core Architecture Strives to the Stratix IV GX family architecture highlighted in the device handbook, providing device-level features for high-bandwidth and protocol support.
- Logic Capacity 7030 LABs and 175,750 logic elements to implement complex, wide datapath designs and large logic fabrics.
- Embedded Memory Approximately 13.95 Mbits of embedded memory (13,954,048 bits) for buffering, packet processing, and on-chip data storage.
- I/O Resources 372 general-purpose I/O pins to support broad connectivity and multi-interface systems.
- Transceiver and Interface Capability Documented Stratix IV GX device features include high-speed transceiver support and external memory interface capability as part of the device family architecture.
- Power Supply Range Core voltage specified at 870 mV to 930 mV to match platform power-design constraints.
- Package & Mounting Surface-mount FCBGA packaging: 780-FBGA (29×29) / 780-BBGA package case for space-efficient board integration.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-Speed Communications Leveraging the Stratix IV GX device family transceiver features and protocol support for serializer/deserializer and link-aggregation tasks.
- Network Infrastructure Implement packet processing, traffic management, and protocol bridging using the device’s large logic capacity and embedded memory.
- External Memory Interfaces Act as a controller or bridge for high-bandwidth external memory interfaces, utilizing the family’s documented external memory features.
- DSP and Signal Processing Support digital signal processing blocks and wide datapaths within the Stratix IV family for imaging, video, and sensor-data processing pipelines.
Unique Advantages
- High Logic Density: 175,750 logic elements and 7030 LABs enable large-scale, complex designs without partitioning into multiple devices.
- Substantial On-Chip Memory: Approximately 13.95 Mbits of embedded RAM reduces external memory dependency and simplifies buffer management.
- Robust I/O Count: 372 I/O pins provide flexibility to connect multiple interfaces and peripherals directly to the FPGA fabric.
- Stratix IV GX Device Family: Family-level support for high-speed transceivers and a wide range of protocol and interface features documented in the Stratix IV handbook.
- Compact FCBGA Package: 780-FBGA (29×29) FCBGA package and surface-mount mounting facilitate dense PCB layouts and automated assembly.
- Commercial-Grade & RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial production environments.
Why Choose EP4SGX180DF29C4G?
The EP4SGX180DF29C4G delivers a combination of high logic capacity, significant embedded memory, and ample I/O resources within the Stratix IV GX family architecture. It is positioned for commercial designs that require configurable, high-throughput logic, integrated memory resources, and documented high-speed interface capabilities.
This device is suited to engineering teams building connectivity, networking, and DSP-centric systems that need scalable programmable logic, predictable operating conditions, and the architectural features outlined in the Stratix IV device handbook.
Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX180DF29C4G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018